ATS-52450P-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1146-ND

Manufacturer Part#:

ATS-52450P-C1-R0

Price: $ 6.78
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 45MM X 45MM X 17.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-52450P-C1-R0 datasheetATS-52450P-C1-R0 Datasheet/PDF
Quantity: 1168
1 +: $ 6.16770
10 +: $ 6.00327
25 +: $ 5.66975
50 +: $ 5.33610
100 +: $ 5.00264
250 +: $ 4.66913
500 +: $ 4.33562
1000 +: $ 4.25225
Stock 1168Can Ship Immediately
$ 6.78
Specifications
Series: maxiFLOW
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Shape: Square, Angled Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.689" (17.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 1.60°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a crucial part of any high-power electronic system. Heat sinks are a common element of thermal management, used to ensure that components remain within safe temperature limits. The ATS-52450P-C1-R0 is a heat sink designed for use in demanding applications. This article will discuss the application field of the ATS-52450P-C1-R0, as well as its working principles.

The ATS-52450P-C1-R0 is a high-performance heat sink designed for use in a variety of demanding applications. It is well suited for applications that require high thermal efficiency, such as power supplies, processors, and amplifiers. It is also suitable for applications where space is a premium, such as medical and satellite systems. The ATS-52450P-C1-R0 offers excellent heat dissipation, allowing users to conduct heat-intensive operations without compromising reliability.

The ATS-52450P-C1-R0 is designed to provide maximum performance in its application field. Its high-efficiency design utilizes an array of pin fins to improve heat dissipation capability. The pin fins are designed to maximize the surface area available for heat transfer, allowing for efficient heat dissipation. Additionally, the ATS-52450P-C1-R0 is designed with a robust mounting system, making it easy to install and remove.

In addition to its high-performance design, the ATS-52450P-C1-R0 also features a unique working principle. This heat sink relies on a combination of natural convection and forced convection to dissipate heat. Natural convection occurs when air around the component is heated, causing it to rise and become replaced with cooler air, allowing for efficient heat dissipation. Forced convection occurs when a fan is used to move the air around the component, thus increasing the convection effect.

The combination of natural and forced convection allows the ATS-52450P-C1-R0 to effectively dissipate heat from components, even in demanding applications. Additionally, the ATS-52450P-C1-R0 offers a number of advantages over traditional heat sinks. For instance, the presence of pin fins increases the surface area for heat dissipation, allowing for better performance in tight spaces. Additionally, its robust mounting system ensures that the device remains secure and reliable over long periods of use.

The ATS-52450P-C1-R0 is an ideal heat sink for demanding applications. Its high-performance design and unique working principle allow it to effectively spread heat even in tight spaces. Additionally, its robust mounting system ensures that the device is reliable and secure over long periods of use. With its many advantages, the ATS-52450P-C1-R0 is an excellent choice for thermal management in a wide range of settings.

The specific data is subject to PDF, and the above content is for reference

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