ATS-53170D-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS1147-ND

Manufacturer Part#:

ATS-53170D-C1-R0

Price: $ 5.96
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEAT SINK 17MM X 17MM X 9.5MM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-53170D-C1-R0 datasheetATS-53170D-C1-R0 Datasheet/PDF
Quantity: 79
1 +: $ 5.41800
10 +: $ 5.26869
25 +: $ 4.97599
50 +: $ 4.68317
100 +: $ 4.39047
250 +: $ 4.09777
500 +: $ 3.80507
1000 +: $ 3.73190
Stock 79Can Ship Immediately
$ 5.96
Specifications
Series: maxiGRIP
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Clip, Thermal Material
Shape: Square, Fins
Length: 0.669" (17.00mm)
Width: 0.669" (17.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.374" (9.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 24.30°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks, or simply heat sinks, are components used in many electronic applications that require thermal dissipation. Heat sinks are usually made of metal such as aluminum, copper, or steel.

The ATS-53170D-C1-R0 is a high performance thermal heat sink. This heat sink has a large surface area which enables efficient heat dissipation. It is also lightweight so it can be used in tight spaces. This heat sink has a radiant coated copper core and a dielectric material which protects the fins from corrosion. The ATS-53170D-C1-R0 is designed to be used in downhole, subsea and surface applications.

The heat sink operates on a simple principle: it utilizes the physical properties of convection to dissipate heat away from a hot source. When heat is applied to the heat sink, it absorbs that heat and transfers it away from the source by convection. The warm air surrounding the heat sink rises, carrying the heat away with it. As the air rises, it is replaced by cooler air, which is then heated and the process is repeated. This is how the heat is dissipated away from the source. The heat sink’s fins also help to increase the surface area in contact with the air, allowing for more efficient heat transfer.

The ATS-53170D-C1-R0 heat sink is suitable for a variety of applications including power electronics, computers, communications, automotive, test equipment, and instrumentation. It is capable of dissipating up to 15 watts of power in ambient air. The ATS-53170D-C1-R0 features an adjustable heat sink base which makes it easy to adjust the heat sink height to fit the requirements of each application.

The ATS-53170D-C1-R0 heat sink is designed to provide maximum heat transfer in high temperature applications. It features a high-performance cooling fan with adjustable speed varying from 500-3000RPM with a single phase supply. Additionally, the heat sink has integrated LED indicators which make it easy to monitor the fan performance. The fan is designed to provide a long life and reliable performance.

Due to its increased surface area, the ATS-53170D-C1-R0 heat sink provides improved cooling performance and extended life of the thermal devices connected to it. It can be used in a wide range of applications and environments. Its lightweight construction makes it easy to install and transport. The heat sink is also highly reliable and stable, making it an ideal choice for applications that require a long life and high performance.

The specific data is subject to PDF, and the above content is for reference

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