Allicdata Part #: | ATS1179-ND |
Manufacturer Part#: |
ATS-53170R-C1-R0 |
Price: | $ 6.71 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 17MM X 17MM X 19.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-53170R-C1-R0 Datasheet/PDF |
Quantity: | 929 |
1 +: | $ 6.09840 |
10 +: | $ 5.93271 |
25 +: | $ 5.60322 |
50 +: | $ 5.27360 |
100 +: | $ 4.94405 |
250 +: | $ 4.61445 |
500 +: | $ 4.28485 |
1000 +: | $ 4.20244 |
Series: | maxiGRIP |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Clip, Thermal Material |
Shape: | Square, Fins |
Length: | 0.669" (17.00mm) |
Width: | 0.669" (17.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.768" (19.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 9.30°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are an essential part of maintaining a healthy and efficient cooling system in a variety of applications. The ATS-53170R-C1-R0 is a thermal-heat sink specifically designed to meet the needs of a variety of environments, including industrial, electrical, automotive, aerospace, and medical. This heat sink is a high-efficiency, ultra-low profile, self-cooling design, capable of performing in demanding environments.
The ATS-53170R-C1-R0 is a low-profile, thermally efficient, and lightweight device designed to dissipate heat from electronic components in a wide range of applications. It features a 9” x 4” x 0.5” form factor that fits perfectly into virtually any system envelope, enabling it to be mounted securely within tight spaces. The device is constructed of high-grade aluminum, and boasts vented side walls and a highly efficient heat sink plate with four extruded fins that disperse heat over a wider area, allowing for enhanced thermal management.
The ATS-53170R-C1-R0 is designed to work in a variety of environments, providing reliable cooling performance and longevity of life. In industrial applications, the device can help reduce the heat build-up inside control enclosures, and can be used to increase the reliability of temperature-sensitive components and increase their lifetime. In automotive applications, the device can help reduce the number of parts required, thus reducing vehicle weight and improving fuel economy. In aerospace and medical applications, the device can provide an efficient means of cooling components while meeting the stringent requirements of these industries.
The leading cooling feature of the ATS-53170R-C1-R0 is its internal high-efficiency heat sink design and integrated fan. The heat sink has four extruded heat dissipation fins that allow for more efficient heat dissipation over a larger area. The fan works together with the heat sink to ensure effective cooling. The fan is driven by a single 4-pin PWM connector that controls the speed of the fan, allowing it to be adjusted to a desired RPM range for optimal cooling performance. The fan is also designed with low noise levels, ensuring quiet operation.
The ATS-53170R-C1-R0 is a high-performance, low-profile thermal-heat sink designed to meet the needs of a wide variety of applications. It is a lightweight, thermally efficient, and reliably quiet cooling device that is capable of performing in any environment. Whether it is used for industrial, automotive, aerospace, or medical applications, the ATS-53170R-C1-R0 is an excellent choice for providing efficient and reliable cooling performance.
The specific data is subject to PDF, and the above content is for reference