| Allicdata Part #: | ATS1149-ND |
| Manufacturer Part#: |
ATS-53210D-C1-R0 |
| Price: | $ 6.15 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 21MM X 21MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53210D-C1-R0 Datasheet/PDF |
| Quantity: | 12 |
| 1 +: | $ 5.53140 |
| 10 +: | $ 5.38335 |
| 25 +: | $ 5.08410 |
| 50 +: | $ 4.78498 |
| 100 +: | $ 4.48592 |
| 250 +: | $ 4.18685 |
| 500 +: | $ 3.88779 |
| 1000 +: | $ 3.81303 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.827" (21.00mm) |
| Width: | 0.827" (21.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 20.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks have often been the go-to solution for cooling electronics components. And although other alternatives, such as liquid cooling, offer increased efficiency, generally a heat sink is the simplest, most efficient, and least expensive solution for most applications. The ATS-53210D-C1-R0 is a heat sink that has become increasingly popular among applications where high heat dissipation needs to occur in a small form-factor.
The ATS-53210D-C1-R0 is a low-profile heat sink that provides maximum heat dissipation within a limited form-factor. Its design is optimized for applications where multiple components requiring increased cooling capacity are mounted in close proximity to each other, such as next to a printed circuit board. One of the key features of the ATS-53210D-C1-R0 is its aluminum/carbon fiber composite fin construction. This provides a high thermal conductivity to help transfer the heat away from the components quickly and efficiently.
To ensure optimal performance, the ATS-53210D-C1-R0 is available with a variety of accessories, such as adhesive epoxy and a thermal conductivity silicone layer, which helps to increase the thermal performance further. The epoxy helps to create a permanent and solid bond between the heat sink and the component to ensure that the heat is transferred away from the component more effectively. In addition, the adhesive epoxy and thermal conductivity silicone layer help to reduce vibration.
The ATS-53210D-C1-R0 is ideal for use in applications where components require increased cooling due to a high-heat load. This heat sink can easily be retrofitted into existing applications, and its small form-factor allows it to be installed in even the toughest spaces. It is also suitable for applications with a wide range of different operating environments, as it is made from materials that offer superior resistance to moisture, corrosion, and thermal shock.
When the ATS-53210D-C1-R0\'s aluminum/carbon fiber composite fin construction is combined with its wide selection of accessories, it can offer an efficient thermal solution that is more compact and cost-effective than many comparable heat sinks. This makes it a great choice for applications where a small, reliable, and efficient thermal heat sink is needed.
The specific data is subject to PDF, and the above content is for reference