| Allicdata Part #: | ATS1181-ND |
| Manufacturer Part#: |
ATS-53210R-C1-R0 |
| Price: | $ 6.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 21MM X 21MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: | ATS-53210R-C1-R0 Datasheet/PDF |
| Quantity: | 59 |
| 1 +: | $ 6.21810 |
| 10 +: | $ 6.04737 |
| 25 +: | $ 5.71133 |
| 50 +: | $ 5.37541 |
| 100 +: | $ 5.03950 |
| 250 +: | $ 4.70353 |
| 500 +: | $ 4.36757 |
| 1000 +: | $ 4.28357 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.827" (21.00mm) |
| Width: | 0.827" (21.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-53210R-C1-R0 is an important part of a thermal management system. It is a heat sink with a housing designed for various applications in air and liquid cooling systems. Thermal management systems are important in preventing overheating of electronics, motors, and other components. This article will provide an overview of ATS-53210R-C1-R0 application field and working principle.
ATS-53210R-C1-R0 application field includes electronics, motors, motorsport, and many other industries. The housing of the heat sink is designed to evenly spread heat from a component and to dissipate it to the surroundings. This is possible through the insulated heat spreader plate located inside the housing. The heat spreader plate is made of aluminum or copper and is designed to absorb and distribute heat quickly and efficiently. The design of the housing also helps to reduce the amount of air turbulence, thus creating an ambient air temperature. This is beneficial for electronics and motors, as hot air currents can cause components to overheat.
In terms of working principle, the ATS-53210R-C1-R0 is designed to draw heat away from components and disperse it to the environment. This happens as heat is conducted through the heat spreader plate, which absorbs the heat and transfers it to the air outside. This is done with a cooling fan that circulates air through the housing. The fan is designed to move the warm air outside, while the cooler air circulates back into the housing. This helps to evenly cool the components and stop them from overheating.
The ATS-53210R-C1-R0 is an important component of many thermal management systems. It is designed to draw heat away from components and disperse it to the environment, which is beneficial for preventing overheating of electronic components, motors, and other components. The housing of the heat sink is designed to evenly spread the heat, while the heat spreader plate is able to absorb and disperse it quickly and efficiently. The cooling fan helps move out warm air and bring in the cooler air, creating an even temperature inside the housing. Overall, this provides an effective solution to managing heat and preventing component overheating.
The specific data is subject to PDF, and the above content is for reference
ATS-53210R-C1-R0 Datasheet/PDF