| Allicdata Part #: | ATS1166-ND |
| Manufacturer Part#: |
ATS-53230K-C1-R0 |
| Price: | $ 6.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 23MM X 23MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53230K-C1-R0 Datasheet/PDF |
| Quantity: | 1421 |
| 1 +: | $ 6.02910 |
| 10 +: | $ 5.86404 |
| 25 +: | $ 5.53846 |
| 50 +: | $ 5.21262 |
| 100 +: | $ 4.88678 |
| 250 +: | $ 4.56100 |
| 500 +: | $ 4.23521 |
| 1000 +: | $ 4.15376 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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ATS-53230K-C1-R0 is a type of thermal - heat sink product that has a wide range of applications. It is designed to provide thermal relief for electronic components and to increase overall system efficiency and reliability. It is also capable of dissipating up to 20W of power under extreme conditions.
Due to its simple yet effective design, the ATS-53230K-C1-R0 is suitable for a wide variety of applications, including computers, servers, medical devices, and industrial equipment. It is also suitable for use in automotive, military, and aerospace environments, due to its excellent heat dissipation capabilities.
The ATS-53230K-C1-R0 consists of a heat sink base, a heat sink fin, and a mounting bracket. The heat sink base is made of extruded aluminum with anodizing finish. The fin is made of extruded aluminum with a black ionic coating. The mounting bracket is made of an aluminum alloy that is further treated with black lacquer. All of these components are designed to optimize heat dissipation and ensure a strong attachment to the device.
The working principle of the ATS-53230K-C1-R0 is very simple. It utilizes the natural process of convection heat transfer to draw heat away from the device. Heat travels from the hot area to the cooler areas in the environment via natural convection currents. As the heat moves away from the device, it is dissipated by the aluminum fins. The aluminum fins have a larger surface area compared to the original surface, allowing for more effective heat dissipation.
The ATS-53230K-C1-R0 also has a high performance thermal interface material (TIM) between the heat sink base and the device to aid in the heat transfer process. This ensures that heat is efficiently conducted away from the device and dissipated by the fins. Additionally, the mounting brackets and screws help to provide a secure connection between the heat sink and the device, allowing for effective heat transfer.
Overall, the ATS-53230K-C1-R0 is an excellent thermal - heat sink product with a wide range of applications. Its efficient design and reliable performance make it ideal for a variety of applications, from computer systems to military and aerospace applications. With its superior heat transfer capabilities, the ATS-53230K-C1-R0 is perfect for any critical thermal management application.
The specific data is subject to PDF, and the above content is for reference