| Allicdata Part #: | ATS1182-ND |
| Manufacturer Part#: |
ATS-53230R-C1-R0 |
| Price: | $ 6.92 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 23MM X 23MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53230R-C1-R0 Datasheet/PDF |
| Quantity: | 767 |
| 1 +: | $ 6.28740 |
| 10 +: | $ 6.11604 |
| 25 +: | $ 5.77634 |
| 50 +: | $ 5.43652 |
| 100 +: | $ 5.09676 |
| 250 +: | $ 4.75698 |
| 500 +: | $ 4.41720 |
| 1000 +: | $ 4.33225 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-53230R-C1-R0 is a thermal heat sink, designed to dissipate the heat generated by an array of semiconductor components. The device is comprised of several parallel fins integrated onto a single component. The fins help to provide additional surface area to increase the rate of heat dissipation. The fins are connected to the base of the heat sink and the top of the fins are exposed to the environment, thus allowing air to flow through them and absorb the generated heat.
The ATS-53230R-C1-R0 is primarily used in electronic devices to manage the heat generated by high power components. The device is ideal for compact electronic systems, such as portable devices, as the device\'s compact design is very efficient and takes up minimal space while offering excellent thermal performance. The device is often found in industrial applications, such as an industrial desktop computer, where large amounts of heat need to be dissipated to maintain consistent temperatures.
The ATS-53230R-C1-R0 working principle is similar to that of other thermal heat sinks. The device features a base plate with several fins connected to it. The fins are exposed to the environment, allowing air to flow through and absorb the heat generated by the semiconductor components. The heat is then transferred to the fins and the air, which is then absorbed by the environment. The device also features a thermal insulation pad, which helps to reduce the rate of heat transfer and improve overall efficiency.
The ATS-53230R-C1-R0 is an ideal thermal heat sink for a variety of applications, ranging from consumer electronics to industrial applications. The device is designed for maximum thermal performance and durability, while offering a low cost solution. The device is easy to install and requires minimal maintenance. The device\'s design also ensures that it is resistant to corrosion and offers excellent heat transfer characteristics.
In conclusion, the ATS-53230R-C1-R0 is an ideal thermal heat sink for applications that require a compact and efficient design. The device features a base plate with several fins connected to it, which help to increase the rate of heat dissipation. The device also features a thermal insulation pad, which helps to reduce the rate of heat transfer and improve overall efficiency. The device is designed for maximum thermal performance and durability, while offering a low cost solution.
The specific data is subject to PDF, and the above content is for reference