| Allicdata Part #: | ATS1151-ND |
| Manufacturer Part#: |
ATS-53250D-C1-R0 |
| Price: | $ 6.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 25MM X 25MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53250D-C1-R0 Datasheet/PDF |
| Quantity: | 810 |
| 1 +: | $ 5.63850 |
| 10 +: | $ 5.48604 |
| 25 +: | $ 5.18137 |
| 50 +: | $ 4.87658 |
| 100 +: | $ 4.57185 |
| 250 +: | $ 4.26704 |
| 500 +: | $ 3.96224 |
| 1000 +: | $ 3.88604 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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ATS-53250D-C1-R0 Thermal – Heat Sinks
Thermal – Heat sinks, such as the ATS-53250D-C1-R0, are objects designed to dissipate thermal energy as a form of heat away from the component or system it is attached to, in order to improve its performance and prolong its lifespan. ATS-53250D-C1-R0 is a specific type of Heat Sink which is customized for high-power, high-speed applications.
Applications
The ATS-53250D-C1-R0 is ideally suited for cooling components in data-centers, server rooms, and industrial applications, such as LED lighting, electric drive systems, power supplies, and other types of circuit boards or systems. Because of its high efficiency, the ATS-53250D-C1-R0 can also be used in areas where there may be limited space, such as embedded systems, flexible electronics, and heat-sensitive medical equipment. It has also been used in automotive applications, such as vehicle fuel systems, exhaust systems, ignition systems, and other areas where a reduction in heat is needed.
Operating Principle
At a basic level, the operating principal of the ATS-53250D-C1-R0 is to spread the heat it receives from the component or system it is attached to over a large area. This increases the surface area of the Heat Sink and allows heat to be dissipated more efficiently, resulting in better performance and a longer lifespan of the equipment being cooled.
The Heat Sink works by transferring heat through conduction, by taking heat away from the components and distributing it evenly across its own aluminum surface, cooling the system down. This is further enhanced by the class-3 (thermal) coating that the Heat Sink is plated with. This layer of coating improves the thermal efficiency of the Heat Sink, allowing it to dissipate heat even faster.
The ATS-53250D-C1-R0 is designed with a unique profile, allowing it to be used on a variety of different sized components or systems. This makes the Heat Sink more versatile and easier to install. The Heat Sink also utilizes the technology of a thermopile, which is a type of heat-sensitive device that can measure the temperature of the component or system it is attached to and transfer this information to the Heat Sink’s control system. This allows the Heat Sink to respond automatically to changes in temperature, further improving its efficiency.
Conclusion
The ATS-53250D-C1-R0 Thermal – Heat Sink is an efficient and versatile tool for dissipating heat away from components or systems that require cooling. Its use of conduction, a class-3 coating, and a thermopile make the ATS-53250D-C1-R0 perfect for data-centers, server rooms, industrial applications, LED lighting, and other areas where a reduction in heat is needed.
The specific data is subject to PDF, and the above content is for reference