| Allicdata Part #: | ATS1167-ND |
| Manufacturer Part#: |
ATS-53250K-C1-R0 |
| Price: | $ 6.70 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 25MM X 25MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53250K-C1-R0 Datasheet/PDF |
| Quantity: | 187 |
| 1 +: | $ 6.08580 |
| 10 +: | $ 5.92137 |
| 25 +: | $ 5.59238 |
| 50 +: | $ 5.26352 |
| 100 +: | $ 4.93454 |
| 250 +: | $ 4.60555 |
| 500 +: | $ 4.27658 |
| 1000 +: | $ 4.19433 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal-heat sinks are an important part of cooling and temperature control systems found in a variety of applications. One of the most advanced and popular models is the ATS-53250K-C1-R0 heat sink, which is well-suited for use within power electronic systems and has been designed to provide superior performance in a variety of applications.
The ATS-53250K-C1-R0 is a lightweight extruded aluminum heat sink with a copper base for efficient heat transfer. The model is equipped with a mounting plate, which allows for easy installation onto a range of different devices and surfaces. The heat sink is fabricated with a wide heat dissipating fin surface area that distributes the heat across a large area. This allows for faster and more efficient heat dissipation with minimal hot spots.
The ATS-53250K-C1-R0 is designed to provide optimal thermal performance in a range of applications, such as cooling power electronic devices such as amplifiers, LEDs, and power rectifiers. It can also be used in cooling services, combustion systems, automotive engines, and other applications where thermal management components are essential.
The ATS-53250K-C1-R0 has been designed to offer a high level of thermal performance has a minimal footprint. Its wide fin surface area helps to ensure even heat distribution, while the lightweight aluminum and copper construction helps to optimize weight and size. The aluminum construction offers excellent thermal conductivity and long-term durability, making the heat sink ideal for use in a range of approaches.
In terms of performance, the ATS-53250K-C1-R0 features a slim design meant to create a larger thermal resistant heat sink area. This helps to ensure that the heat generated by the electronic device is effectively dissipated into the surrounding environment. The heatsink also features an optimized distance between each of the fins, which helps to increase heat dissipation and minimize thermal resistance.
Additionally, the copper base of the heat sink helps to create an efficient thermal path. The base helps to absorb and transfer higher temperature ranges, leading to even more efficient thermal performance. The aluminum fins on the heat sink help to trap heat and disperse it more evenly, thus creating an even and uniform heat distribution from the heat source.
Overall, the ATS-53250K-C1-R0 is an ideal solution for cooling in a range of applications. Its lightweight aluminum and copper construction is corrosion resistant and offers high performance with minimal system weight. The slim chassis and wide heat dissipating fin surface area help to ensure maximum thermal performance with optimal weight and size.
The specific data is subject to PDF, and the above content is for reference