| Allicdata Part #: | ATS1183-ND |
| Manufacturer Part#: |
ATS-53250R-C1-R0 |
| Price: | $ 7.05 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 25MM X 25MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53250R-C1-R0 Datasheet/PDF |
| Quantity: | 129 |
| 1 +: | $ 6.40710 |
| 10 +: | $ 6.23448 |
| 25 +: | $ 5.88823 |
| 50 +: | $ 5.54173 |
| 100 +: | $ 5.19542 |
| 250 +: | $ 4.84906 |
| 500 +: | $ 4.50270 |
| 1000 +: | $ 4.41611 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-53250R-C1-R0 is a type of thermal heat sinks used in many applications today. A heat sink is an essential part of a device that helps to cool off the components in it. A heat sink can also be a great way to protect a component from excessive heat damage as well.
The purpose of a heat sink is to dissipate heat from a device so that the device does not overheat. A heat sink is a type of metal that is made to absorb and dissipate heat away from a component in the device, such as a processor. This helps to keep the component at a lower temperature, and allows the device to run more efficiently. The more efficient the device runs, the better the performance from it.
ATS-53250R-C1-R0 is a thermal heat sink specifically designed for use in consumer electronics, computing, and industrial applications. This type of heat sink is made from aluminum, which makes it light, yet strong and durable. It is designed to dissipate heat quickly and evenly, helping to keep the device at a lower temperature. The heat sink is also designed to absorb and retain heat, so that it can absorb the heat generated from the device and store it until it can be dissipated.
The ATS-53250R-C1-R0 heat sink is designed to be used in a variety of applications. It can be used in a computer’s CPU, to help keep the processor from overheating and to maintain performance levels. It can also be used on video cards in a desktop computer, to keep the processor from losing performance due to excessive heat. Additionally, this type of heat sink can be used in industrial applications, such as on large industrial machines to prevent them from overheating.
Because of its lightweight design, the ATS-53250R-C1-R0 heat sink can be installed in tight spaces, such as with laptops and computers with limited space. It is also designed to be installed in an efficient, streamlined manner, with minimal fuss or hassle. This helps to ensure that the installation process is quick and easy, and allows the device to perform at its peak efficiency levels.
The ATS-53250R-C1-R0 heat sink has several features that make it a great choice for a variety of applications. First, it is designed to dissipate heat quickly and evenly, helping to keep the device’s temperature at a lower level. Additionally, it is designed to absorb the heat generated from the device, and retain it until the heat can be dissipated.
The ATS-53250R-C1-R0 heat sink is an excellent choice for a wide variety of applications. It is lightweight, durable, and designed to absorb and dissipate heat quickly and evenly. It is also designed to be installed in an efficient and streamlined manner, making it easy to install in tight spaces. This type of heat sink is a great choice for any consumer electronic device, computing, and industrial application, helping to ensure that the device runs at its peak efficiency levels.
The specific data is subject to PDF, and the above content is for reference