| Allicdata Part #: | ATS1152-ND |
| Manufacturer Part#: |
ATS-53270D-C1-R0 |
| Price: | $ 6.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 27MM X 27MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53270D-C1-R0 Datasheet/PDF |
| Quantity: | 812 |
| 1 +: | $ 5.69520 |
| 10 +: | $ 5.54337 |
| 25 +: | $ 5.23555 |
| 50 +: | $ 4.92748 |
| 100 +: | $ 4.61954 |
| 250 +: | $ 4.31157 |
| 500 +: | $ 4.00360 |
| 1000 +: | $ 3.92661 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-53270D-C1-R0 thermal - heat sink is a device that is designed primarily to dissipate the thermal energy created by components of electronic circuitry and other applications. It is an essential component in the design of any electronic system and can help protect against the damaging effects of heat. In this article, we will explore the application field and working principle of the ATS-53270D-C1-R0 thermal - heat sink.
The ATS-53270D-C1-R0 thermal - heat sink is primarily used in high power environments such as computers, servers, telecommunications systems, and medical instrumentation. In these settings, it can help increase the efficiency of cooling systems, helping to ensure components are operating safely and reliably. The ATS-53270D-C1-R0 is also suitable for many other applications where heat is a concern, such as industrial applications.
The working principle of the ATS-53270D-C1-R0 thermal - heat sink is based on the physics of convection. The heat sink is made of a metal material that is able to conduct heat away from its point of origin. The metal absorbs the heat, and then dissipates it into the atmosphere by creating air currents over its surface. These air currents are then carried away from the heat sink, thus cooling off its components and protecting them from damage due to overheating.
The ATS-53270D-C1-R0 thermal - heat sink is designed to provide maximum efficiency in order to dissipate the most amount of heat during operation. Its overall heat transfer rate is particularly high due to its design. The metal material and the fin design of the heat sink allow for increased surface area, which helps in cooling off components quickly and effectively. Additionally, the ATS-53270D-C1-R0 has a high thermal resistance, meaning it can be used in a wide variety of temperatures.
The ATS-53270D-C1-R0 thermal - heat sink is designed to provide an efficient way to dissipate heat quickly and without any additional noise. It is widely used in many different types of electronic devices, such as computers and telecommunications systems. The efficient design of the heat sink ensures maximum safety and reliability, making it an invaluable addition to any electronic system.
In conclusion, the ATS-53270D-C1-R0 thermal - heat sink is a highly effective way to remove heat from electronic devices. Its efficient design helps to ensure maximum safety and reliability, while also being capable of operating in many different temperatures. The ATS-53270D-C1-R0 is an essential part of any electronic system, and is a powerful tool for reducing the amount of heat generated by components.
The specific data is subject to PDF, and the above content is for reference