| Allicdata Part #: | ATS1168-ND |
| Manufacturer Part#: |
ATS-53270K-C1-R0 |
| Price: | $ 6.76 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 27MM X 27MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53270K-C1-R0 Datasheet/PDF |
| Quantity: | 897 |
| 1 +: | $ 6.14250 |
| 10 +: | $ 5.97870 |
| 25 +: | $ 5.64656 |
| 50 +: | $ 5.31443 |
| 100 +: | $ 4.98223 |
| 250 +: | $ 4.65008 |
| 500 +: | $ 4.31793 |
| 1000 +: | $ 4.23489 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-53270K-C1-R0 thermal-heat sink is a versatile thermal management device that can be used for a variety of applications. With its reliable construction and design, this highly efficient device is capable of managing and dissipating heat generated by any type of electronic equipment, including computers, servers, and other electronic components. The device works to regulate the temperature of the components and then dissipate it through convective cooling in order to keep the components within an acceptable temperature range.
The ATS-53270K-C1-R0 is designed to keep the temperature of the electronic components at an optimal level while not consuming too much power. It works by providing heat dissipation, absorbing heat from components and transferring it away from the device. This is accomplished through a series of air ducts and fans that circulate and the hot air away from the components. The air ducts are designed in such a way that the heat is distributed evenly throughout the enclosure.
The ATS-53270K-C1-R0 works in two separate ways to dissipate heat. The first mechanism is convective cooling, which is an efficient method of transferring the heat away from the components. This is done by passing the hot air from the components through the air ducts and out of the device. The second way it works is by using a system of heat sinks that absorb the heat from the components and transfer it away. Heat sinks are a type of device that is designed to absorb and dissipate heat from electronic components.
The ATS-53270K-C1-R0 is also designed to maintain an optimal temperature in a variety of applications. For computers and servers, the device can be used to keep the internal components cool by dissipating the heat through convective cooling. It can also be used for cooling high-intensity lighting in industrial applications, as well as cooling medical imaging devices. In addition, this thermal-heat sink can be used for cooling electronic components in automobiles, and for cooling military and aerospace components.
The ATS-53270K-C1-R0 is a reliable and efficient device that can be used for a variety of applications. It is able to dissipate heat quickly and effectively and keep the components of electronic equipment at optimal temperatures. With its simple design and powerful performance, the ATS-53270K-C1-R0 thermal-heat sink is an ideal choice for any application requiring reliable and efficient thermal management.
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