| Allicdata Part #: | ATS1184-ND |
| Manufacturer Part#: |
ATS-53270R-C1-R0 |
| Price: | $ 7.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 27MM X 27MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53270R-C1-R0 Datasheet/PDF |
| Quantity: | 48 |
| 1 +: | $ 6.41340 |
| 10 +: | $ 6.24204 |
| 25 +: | $ 5.89529 |
| 50 +: | $ 5.54854 |
| 100 +: | $ 5.20178 |
| 250 +: | $ 4.85498 |
| 500 +: | $ 4.50819 |
| 1000 +: | $ 4.42149 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-53270R-C1-R0 is a thermal heat sinks device designed to cool electronics components and systems for a wide range of application areas. It is designed for use in both commercial and industrial applications, and is suitable for applications that require a high degree of thermal performance with a low profile and low profile thermal resistance in a very small size.
The ATS-53270R-C1-R0 is designed with a non-conductive heat sink that has excellent thermal transfer properties in a small package. The thermally conductive material provides a high degree of thermal dissipation even in high operating temperatures, allowing reliable thermal management in a very small package.
A unique feature of the ATS-53270R-C1-R0 heat sink is its ability to absorb and dissipate heat from sources of varying temperature. Its design incorporates a thermally conductive material that allows the heat sink to absorb and dissipate heat much more quickly than traditional methods. This makes it ideal for applications requiring fast heat transfer and cooling in large areas. It\'s also extremely reliable in industrial applications.
The ATS-53270R-C1-R0 heat sink works by transferring the heat from the sources to the heat sink through a thermally-conductive material. The heat absorbed by the material is dissipated in the atmosphere, while at the same time providing a low profile thermal resistance for the application. This ensures a high degree of thermal performance for the application, even under extreme conditions.
The ATS-53270R-C1-R0 heat sink is an ideal choice for applications that require fast heat transfer in a small package or area. The thermally-conductive material allows the heat sink to quickly dissipate heat from higher operating temperatures. This helps ensure maximum reliability in both commercial and industrial applications, with excellent thermal performance in both low and high operating temperatures.
This thermal heat sinks device is suitable for a wide range of applications such as power electronics applications, LED lighting systems, motor applications, computer systems, and other similar applications requiring a high degree of thermal performance. The use of this heat sink makes applications more reliable and efficient, and can help increase product life expectancy.
The specific data is subject to PDF, and the above content is for reference