| Allicdata Part #: | ATS1154-ND |
| Manufacturer Part#: |
ATS-53300D-C1-R0 |
| Price: | $ 6.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 30MM X 30MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53300D-C1-R0 Datasheet/PDF |
| Quantity: | 87 |
| 1 +: | $ 5.81490 |
| 10 +: | $ 5.65803 |
| 25 +: | $ 5.34366 |
| 50 +: | $ 5.02929 |
| 100 +: | $ 4.71498 |
| 250 +: | $ 4.40065 |
| 500 +: | $ 4.08632 |
| 1000 +: | $ 4.00774 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal heat sinks are a popular choice when it comes to cooling and dissipating heat from modern electronics. These devices are used to cool CPUs, GPUs, and other electronic components that generate high amounts of heat. The ATS-53300D-C1-R0 is an example of a thermal heat sink.
The ATS-53300D-C1-R0 is a simple, yet highly efficient heat sink. It is a very popular model in the thermal heat sink market due to its performance, reliability, and cost. The design of this heat sink consists of a rectangular fin array that uses air to cool electronics. There are four fins, each with an individual base for optimal performance. The fins are constructed of anodized aluminum to ensure maximum dissipation of heat.
The heat is dissipated into the environment by the fins, which are attached to a base plate made up of an aluminum alloy. This base plate is responsible for transferring the heat from the electronic components to the fins, which then dissipate the heat into the air. Air is then drawn across the fins, absorbing the heat and carrying it away from the electronic components. This process of heat dissipation is known as convection.
The ATS-53300D-C1-R0 is designed to be used in a wide range of applications. It is suitable for use in computers, gaming consoles, servers, networks, and other electronics that generate heat. This heat sink is also perfect for thermal load testing as it offers good thermal performance and reliability.
The ATS-53300D-C1-R0 is a high-performance thermal heat sink and has a thermal capacity of 295 watts, which is enough to dissipate a significant amount of heat from electronics. It also has a maximum thermal resistance of 0.318°C/W, which is very low for a heat sink. This makes it an ideal choice for dissipating heat from high-power electronic components.
Overall, the ATS-53300D-C1-R0 is a reliable and effective solution for cooling and dissipating heat from electronics. It is suitable for a wide range of applications and provides good thermal management. This thermal heat sink is also very inexpensive, making it a great choice for those on a budget.
The specific data is subject to PDF, and the above content is for reference