| Allicdata Part #: | ATS1171-ND |
| Manufacturer Part#: |
ATS-53310K-C1-R0 |
| Price: | $ 6.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 31MM X 31MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53310K-C1-R0 Datasheet/PDF |
| Quantity: | 160 |
| 1 +: | $ 6.33150 |
| 10 +: | $ 6.16203 |
| 25 +: | $ 5.81969 |
| 50 +: | $ 5.47722 |
| 100 +: | $ 5.13494 |
| 250 +: | $ 4.79261 |
| 500 +: | $ 4.45028 |
| 1000 +: | $ 4.36470 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.220" (30.99mm) |
| Width: | 1.220" (30.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are important components to transfer the heat generated by various types of electronic devices and circuit boards to keep the temperature at a safe and steady level. One such device that is widely used in various industries and applications is the ATS-53310K-C1-R0. Its unique combination of design and mechanical features make it suitable for a wide range of applications.
The ATS-53310K-C1-R0 is an advanced thermal heat sink that is fine-tuned to provide optimal thermal transfer efficiency. It is specifically designed for higher power operating systems that generate significant amounts of heat throughout their operating cycle. This heat needs to be managed correctly in order to ensure optimal performance and reliability.
The ATS-53310K-C1-R0 features a unique split fin design which is tailored to transfer heat quickly and efficiently. The advanced design features an optimised combination of baffle plates and specially shaped fins which provide maximum efficiency in heat transfer. The heat generated is quickly drawn away from the device and into the aluminium frame, which is then dissipated to the outside air. This heat transfer process is known as convection-based cooling.
The ATS-53310K-C1-R0 offers more than just efficient cooling; it also features a vibration resistance, suitable for use in a wide range of environments. Its smooth, black anodised casing protects against corrosion and reduces any vibration that could interfere with the device\'s performance.
The ATS-53310K-C1-R0 is designed to be used in a variety of applications, including computer processors, power amplifiers, laser printers, medical equipment, and a range of telecommunication devices. It is also ideal for use in a variety of environments, such as commercial buildings, automotive applications, and industrial equipment.
The ATS-53310K-C1-R0 is an advanced thermal heat sink that is designed to provide efficient cooling while meeting the demands of the most sophisticated and demanding applications. Its unique combination of design and mechanical features make it suitable for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference