| Allicdata Part #: | ATS1187-ND |
| Manufacturer Part#: |
ATS-53310R-C1-R0 |
| Price: | $ 7.27 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 31MM X 31MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53310R-C1-R0 Datasheet/PDF |
| Quantity: | 761 |
| 1 +: | $ 6.60240 |
| 10 +: | $ 6.42537 |
| 25 +: | $ 6.06841 |
| 50 +: | $ 5.71145 |
| 100 +: | $ 5.35450 |
| 250 +: | $ 4.99751 |
| 500 +: | $ 4.64054 |
| 1000 +: | $ 4.55130 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.220" (30.99mm) |
| Width: | 1.220" (30.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important factor to consider when designing an electronic system or component. Heat generated by components must be dissipated to maintain a safe temperature range in order to ensure reliable operation of the equipment. Heat sinks are used to transfer heat away from components and provide cooling, thereby preventing overheating. The ATS-53310R-C1-R0 is a heat sink designed to effectively manage the thermal load of components. In this article we will discuss the application field and working principle of the ATS-53310R-C1-R0.
The ATS-53310R-C1-R0 is a heat sink designed for applications such as LED lighting, power supplies, embedded PCs and servers, electronic device housings, telecommunications, renewable energy, medical equipment and more. It is particularly suited for use in applications where size and thermal performance are both important factors, such as in thermal management solutions for embedded applications. It is also suitable for high-power and custom applications.
The ATS-53310R-C1-R0 is a highly efficient heat sink, made from aluminum alloy. The design of the heat sink helps to spread the heat generated by the component and dissipate it into the surrounding air. The heat sink has a number of fins that act as radiators, which removes the heat from the heatsink and dissipates it into the atmosphere and thus cools down the component. The design of the fins helps to increase the heat-exchanging surface area, thereby improving the overall thermal performance. The fin design also helps to reduce the overall size of the heat sink, making it suitable for applications with limited space requirements.
The ATS-53310R-C1-R0 can be mounted in various ways, such as with screws and clips, which makes it suitable for various installations. The heat sink also has a built-in fan to further improve thermal performance. The fan can be adjusted to provide the desired amount of cooling to the component.
The ATS-53310R-C1-R0 is a reliable and efficient heat sink suitable for use in various applications. It helps to effectively manage the thermal load of components, and is easy to install and maintain. It is an ideal solution for applications requiring efficient thermal management.
The specific data is subject to PDF, and the above content is for reference