| Allicdata Part #: | ATS1188-ND |
| Manufacturer Part#: |
ATS-53325R-C1-R0 |
| Price: | $ 7.34 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 32.5 X 32.5 X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53325R-C1-R0 Datasheet/PDF |
| Quantity: | 93 |
| 1 +: | $ 6.67170 |
| 10 +: | $ 6.49404 |
| 25 +: | $ 6.13318 |
| 50 +: | $ 5.77256 |
| 100 +: | $ 5.41176 |
| 250 +: | $ 5.05096 |
| 500 +: | $ 4.69018 |
| 1000 +: | $ 4.59997 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal resistance is a measure of how well a material can transfer heat from one side to the other. Heat sinks are among the most common passive cooling methods; they absorb and dissipate heat away from electronic components, providing cooling without fans or other active cooling components. The ATS-53325R-C1-R0 is a heat sink produced by ATS Thermal Products, Inc., that is highly effective at dissipating heat. This heat sink in particular is designed to be used with BGA packaged components, such as microprocessors.
The ATS-53325R-C1-R0 features a three-stage thermal diffusing design that disperses heat away from an active component and into a set of aluminum fins. Specifically, this heat sink uses a large copper core to connect to the central part of the component to be cooled. To increase the surface area of contact between the component and the heat sink, the core makes direct contact with the contact points and then extends to the outer perimeter of the component. The heat that is conducted away from the component then travels through several copper layers that are encased within the aluminum fins, providing additional cooling efficiency. The aluminum fins are then designed to evenly disperse heat into the air or other areas.
This heat sink is widely used in applications that require high thermal resistance, such as servers and data centers. The thermal resistance of the ATS-53325R-C1-R0 is generally lower than other similarly-sized heat sinks, giving it a considerable advantage over similar components. Additionally, the component offers a large contact surface area that maximizes thermal performance, further reducing its thermal resistance despite its small size.
The low thermal resistance of the ATS-53325R-C1-R0 also makes it suitable for tight installations. Its small size allows it to fit into spaces that other heat sinks would not be able to, due to their bulkier designs. This makes the unit perfect for high-density systems where space is a premium.
In summary, the ATS-53325R-C1-R0 is an excellent choice for applications that require a combination of high thermal performance and a small footprint. Its three-stage thermal diffusing design makes it highly efficient at transferring heat away from the component and into the air, while its small size makes it suitable for tight areas. This makes the ATS-53325R-C1-R0 an ideal choice for servers and data centers, as well as other applications that require a reliable heat sink with minimal space requirements.
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