| Allicdata Part #: | ATS1173-ND |
| Manufacturer Part#: |
ATS-53330K-C1-R0 |
| Price: | $ 7.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 33MM X 33MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53330K-C1-R0 Datasheet/PDF |
| Quantity: | 97 |
| 1 +: | $ 6.41340 |
| 10 +: | $ 6.24204 |
| 25 +: | $ 5.89529 |
| 50 +: | $ 5.54854 |
| 100 +: | $ 5.20178 |
| 250 +: | $ 4.85498 |
| 500 +: | $ 4.50819 |
| 1000 +: | $ 4.42149 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical component of any electronic design, particularly for high power applications. Heat sinks are designed to dissipate heat away from critical components, reducing the overall temperature of the system and allowing it to continue to operate without degradation. The ATS-53330K-C1-R0 is a robust and efficient heat sink that has been specifically designed for high power applications, including LED lighting, vehicle electronics, and power conversion applications.
The ATS-53330K-C1-R0 heat sink is a cost-effective and versatile choice for a range of high power applications. It is designed to dissipate heat from a variety of devices, including high power LED modules, high current DC-DC converters, and other electronic components. Comprised of an anodized aluminum fin, a copper base plate, and a steel clip, the heat sink efficiently transfers heat from the source device and into the surrounding environment via convection.
The ATS-53330K-C1-R0 heat sink has a maximum heat dissipation rate of 370 W/m2. It features a compact design that measures only 30 mm in height and 75 mm in width, making it ideal for applications where space requirements are limited. It also features an anodized aluminum fin that has a high thermal conductivity, allowing it to efficiently dissipate heat away from the device. Additionally, the copper base plate and steel clip are corrosion-resistant and durable, ensuring long-term reliability and performance.
The ATS-53330K-C1-R0 heat sink is easy to install and is secured to the application device using screws, bolts, or mounting clips. It features a thermally-stable design that can withstand changes in temperature and environment, making it suitable for use in a variety of applications. Additionally, it features a wide operating temperature range of -40°C to +100°C.
In summary, the ATS-53330K-C1-R0 heat sink is a high performing and cost-effective solution for high power applications, such as LED lighting and vehicle electronics. It features a compact design that is easy to install and is thermally-stable enough to withstand a wide range of temperatures and environmental conditions. Additionally, the anodized aluminum fin and copper base plate provide superior heat transfer efficiency, allowing it to effectively dissipate heat away from electronic components.
The specific data is subject to PDF, and the above content is for reference