| Allicdata Part #: | ATS1158-ND |
| Manufacturer Part#: |
ATS-53350D-C1-R0 |
| Price: | $ 6.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 35MM X 35MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53350D-C1-R0 Datasheet/PDF |
| Quantity: | 985 |
| 1 +: | $ 5.99130 |
| 10 +: | $ 5.83002 |
| 25 +: | $ 5.50595 |
| 50 +: | $ 5.18200 |
| 100 +: | $ 4.85818 |
| 250 +: | $ 4.53429 |
| 500 +: | $ 4.21040 |
| 1000 +: | $ 4.12943 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sinks are the components used to cool electronic components by conducting thermal energy away from them. The ATS-53350D-C1-R0 heat sink is a widely used heatsink in a variety of applications. The ATS-53350D-C1-R0 is a single-stack, heavy-duty, highly efficient heat sink, featuring a copper base and fins that are constructed from aluminum alloy. The ATS-53350D-C1-R0 heat sink is highly reliable, and has a long service life.
The ATS-53350D-C1-R0 heat sink is designed to provide maximum efficiency for applications with very high-power density and thermal loads. The ATS-53350D-C1-R0 is designed to be used in high-performance electronic components such as CPUs, GPUs, memory modules, and cryptographic ICs. The ATS-53350D-C1-R0 comes in various sizes and shapes to fit a range of applications, and is designed to meet the highest standards of thermal performance. The ATS-53350D-C1-R0 heat sink also features a very low acoustic noise level.
The working principle of a heat sink is simple. Heat energy is conducted from the electronic component to the heatsink through its thermal interface material. The thermal energy is then dissipated by the heatsink through the thermal radiation emitted by its fins. The thermal energy dissipated by the fins causes air to be drawn in and heated, which causes the air to rise. This causes a convection effect, which in turn draws cooler air in, thus cooling the electronic component and dissipating the heat.
The ATS-53350D-C1-R0 heat sink has a variety of applications. It is widely used in high-performance electronic components such as CPUs, GPUs, memory modules, and cryptographic ICs. It is also suitable for applications such as radiofrequency modules, power semiconductor devices, and heavy-duty resistors. Other uses for the ATS-53350D-C1-R0 heat sink include cooling aircraft engines, medical equipment, military-grade equipment, and computers.
In conclusion, the ATS-53350D-C1-R0 heat sink is a versatile and reliable thermal solution that is suitable for a wide variety of applications. Its heavy-duty construction and high performance make it an ideal choice for high-performance and high-power-density electronic components. The ATS-53350D-C1-R0 heat sink is designed to dissipate thermal energy through its fins, providing a reliable and efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference