| Allicdata Part #: | ATS1190-ND |
| Manufacturer Part#: |
ATS-53350R-C1-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 35MM X 35MM X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53350R-C1-R0 Datasheet/PDF |
| Quantity: | 1032 |
| 1 +: | $ 6.79770 |
| 10 +: | $ 6.61626 |
| 25 +: | $ 6.24859 |
| 50 +: | $ 5.88105 |
| 100 +: | $ 5.51351 |
| 250 +: | $ 5.14594 |
| 500 +: | $ 4.77838 |
| 1000 +: | $ 4.68648 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a crucial element for every electronic device, as it can affect the reliability and performance of the device. Heat sinks are devices that are commonly used to dissipate heat from electronics. The ATS-53350R-C1-R0 is a highly customizable heat sink used to ensure that electronic components stay within their safe temperature range.
The ATS-53350R-C1-R0 is built with a solid copper base offering superior thermal conductivity to move heat away from the component quickly. The base is designed with four pads that allow the component to be mounted securely without any additional hardware. It also has six fins that provide an increased surface area for optimum cooling performance. The six aluminum fins are designed for high pressure die casting, offering improved durability and longer product life.
This particular heat sink operates with a fin-shorting pin feature. This design ensures that the heat from components is spread evenly across all of the fins. By strategically connecting the aluminum fins, it reduces the risk of localized heat spots and thermal concentration which can reduce the efficiency of the heat dissipation. This ensures that the heat sink will work effectively in any application.
The ATS-53350R-C1-R0 is a versatile heat sink solution that can be used for a wide range of applications. This heat sink is ideal for use in commercial, industrial, and residential applications. In commercial applications, the heat sink can be used to dissipate heat from CPUs, GPUs, server racks, and other electronic components. In industrial applications, it can be used for cooling semiconductors, IGBTs, transformers, circuit boards, and more. In residential applications, the heat sink can be used to keep home theater equipment, computers, and game consoles running at optimal temperatures.
The ATS-53350R-C1-R0 is designed to provide superior cooling efficiency with an economical design. By using high pressure die-casting, the fins reduce the risk of structural deformation and reduce the amount of energy needed for cooling. The advanced fin-shorting pin designs allow for improved heat dissipation performance. The four pads also provide a more secure mount when used with a suitable thermal material. This results in a reliable heat sink solution that can be used in a wide range of applications.
The specific data is subject to PDF, and the above content is for reference