| Allicdata Part #: | ATS1159-ND |
| Manufacturer Part#: |
ATS-53375D-C1-R0 |
| Price: | $ 6.65 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 37.5 X 37.5 X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53375D-C1-R0 Datasheet/PDF |
| Quantity: | 95 |
| 1 +: | $ 6.04800 |
| 10 +: | $ 5.88735 |
| 25 +: | $ 5.55988 |
| 50 +: | $ 5.23291 |
| 100 +: | $ 4.90587 |
| 250 +: | $ 4.57881 |
| 500 +: | $ 4.25176 |
| 1000 +: | $ 4.17000 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important aspect of the technology industry, since it helps to keep hardware components functioning at designed levels. In this regard, ATS-53375D-C1-R0 is a high-performance passive thermal solution. Specifically, this component is an elongated heat sink designed for high-power semiconductors and circuit boards, providing enhanced cooling capabilities for updated application fields and system requirements.
The integrated heat-sink component is manufactured from a variety of materials, namely copper, aluminum, nickel, beaded aluminum, along with its own pin array design. Each material is chosen for its specific properties, such as heat dissipation, thermal resistance, and conductivity.
One major advantage of the ATS-53375D-C1-R0 is its ball-driven carriage system and its ability to function in parallel operation. For proper thermal management, an airflow based on the surface conditions of the device is achieved by a motorized fan system, forcibly positioning the heat sink relative to the device. This setup prevents thermal runaway, allowing temperature stabilization through air contact with the heat sink.
Apart from aiding circuit board cooling, the heat sink also provides an additional benefit: controlling thermal interface material (TIM) from two sides of the device surface, thus ensuring efficient thermal conduction. This setup eliminates the need for complex vapor chamber arrangements or gap filler technologies, resulting in improved performance and stability.
By employing an innovative combination of engineering materials, the ATS-53375D-C1-R0 is designed for optimal performance in a wide range of applications. Some of the major use cases include turning the device into a token generator, transmitting, and receiving SSB and QAM signals, as well as managing power transistors, such as flyback supplies and LINFETs.
The ATS-53375D-C1-R0 works by employing a thermal triangle surface pattern, featuring three sets of louvers positioned in 60-degree angles in relation to each other. These allow for the most efficient delivery of cooling air, while also keeping product reliability high. Besides aiding with cooling, this triangle design also helps reduce UV degredation of the base material, preventing signs of aging.
Ultimately, the ATS-53375D-C1-R0 is a unique and highly efficient heat sink featuring optimized thermal performance and robust protection against thermal shock. By integrating an innovative design featuring high-heat transfer efficiency and a strong structure, the system is able to deliver enhanced reliability and superior thermal management for multiple current and future application fields.
The specific data is subject to PDF, and the above content is for reference