| Allicdata Part #: | ATS1191-ND |
| Manufacturer Part#: |
ATS-53375R-C1-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 37.5 X 37.5 X 19.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53375R-C1-R0 Datasheet/PDF |
| Quantity: | 45 |
| 1 +: | $ 6.80400 |
| 10 +: | $ 6.62004 |
| 25 +: | $ 6.25237 |
| 50 +: | $ 5.88445 |
| 100 +: | $ 5.51672 |
| 250 +: | $ 5.14894 |
| 500 +: | $ 4.78116 |
| 1000 +: | $ 4.68922 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Heat sinks are devices used to dissipate or transfer heat from a solid material to its surroundings, often through the use of a fluid. Common examples of heat sinks include cooling components within a computer or industrial machine and components within a laptop. Heat sinks are used to lower the temperature of a component or space by transferring heat away from it. One of the most commonly used heat sink types is the ATS-53375R-C1-R0, which is designed to reduce the amount of heat emitted from electronic components.
The ATS-53375R-C1-R0 is a thermally managed, single heat sink designed for ultra-low power applications. It is constructed from high-performance aluminum alloy that provides a high thermal conductivity and an excellent resistance to corrosion and wear. The heat sink features a two-stage concentric fin design with an advanced heat dissipation capability and a low profile to fit into tight spaces. The ATS-53375R-C1-R0 is also designed with a high-pressure die cast construction to maximize the thermal performance of the heat sink.
The ATS-53375R-C1-R0 is available in two different sizes of 75 and 100mm and is suitable for use in high-volume production environments. The heat sink has an operating temperature range of -40°C to +125°C and can be used in applications where temperatures may reach up to +175°C. The heat sink also features a high-efficiency thermal interface material which reduces temperature variation from device to device.
The ATS-53375R-C1-R0 is easy to install and features a variety of mounting options to meet the needs of most applications. It also includes a clip-on design for easy installation of additional accessories such as fans and temperature sensors. Additionally, the heat sink has a built-in heat spreader to help improve the overall efficiency of the thermal management solution.
The working principle of the ATS-53375R-C1-R0 is relatively simple. Heat is generated by the electronic components and flows into the heat sink, where it is dissipated and transferred away from the electronic components. The heat is transferred through convection, conduction, and radiation. The convection process involves the air around the heat sink moving away the heat, while conduction is the direct transfer of heat from one object to another. Lastly, radiation involves the emission of infrared waves from the object, which carries the heat away from the component.
The ATS-53375R-C1-R0 is an excellent choice for cooling small, enclosed electronic components that operate in high temperatures. It is highly efficient, easy to install, and is extremely reliable. With its compact design and high-performance aluminum alloy construction, it is perfect for use in a variety of applications.
The specific data is subject to PDF, and the above content is for reference