| Allicdata Part #: | ATS1176-ND |
| Manufacturer Part#: |
ATS-53400K-C1-R0 |
| Price: | $ 7.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 40MM X 40MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-53400K-C1-R0 Datasheet/PDF |
| Quantity: | 32 |
| 1 +: | $ 6.58980 |
| 10 +: | $ 6.41403 |
| 25 +: | $ 6.05758 |
| 50 +: | $ 5.70125 |
| 100 +: | $ 5.34492 |
| 250 +: | $ 4.98859 |
| 500 +: | $ 4.63226 |
| 1000 +: | $ 4.54318 |
| Series: | maxiGRIP |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Clip, Thermal Material |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-53400K-C1-R0 Heat Sink is a cooling device used in a variety of applications. It is used in both general-purpose and high-performance computers, servers, data centers, computers, internet appliances, consumer electronics, tablets, and more. It provides efficient cooling for these systems, helping to reduce the workstation or server room temperatures, and keeping systems from overheating.
The ATS-53400K-C1-R0 Heat Sink is a combination of an aluminum base and a series of heat fins. The aluminum base has a good ability to absorb and transfer heat away from the processor or other components. The fins are interconnected to increase surface area, thus dissipating more heat. The fins also provide additional convective cooling, allowing air to circulate freely around the heat sink.
The working principle of the ATS-53400K-C1-R0 Heat Sink is based around the idea of thermodynamics. Heat is transferred from the processor or other components to the base of the heat sink. This heat is then radiated and conducted away from the processor, by the fins. The air above the heat sink is displaced by the warmth, allowing for additional air to pass over the heat sink, creating more convective cooling.
The ATS-53400K-C1-R0 Heat Sink is designed for use in a wide variety of applications. It is often found in computers, servers, data centers, and other systems that generate a lot of heat. It can also be used in embedded systems, graphics cards, and other high-performance electronics. The heat sink provides efficient cooling for these applications, helping to keep the devices from overheating and reduce the overall temperature in the work environment.
The ATS-53400K-C1-R0 Heat Sink is also popular for gaming systems and overclocking. It is designed to be more efficient than traditional heatsinks, helping to reduce the system temperatures and keep components from running too hot. It can be used in laptops and desktops, as well as other gaming applications.
The ATS-53400K-C1-R0 Heat Sink is a versatile cooling device that can be used in a variety of applications. Its design allows for efficient cooling, helping to make the most of any system. Its thermodynamic design and construction helps to make sure that parts remain cool and that the overall temperature in the environment remains comfortable.
The specific data is subject to PDF, and the above content is for reference