| Allicdata Part #: | ATS-54150D-C0-R0-ND |
| Manufacturer Part#: |
ATS-54150D-C0-R0 |
| Price: | $ 3.30 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 15X15X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54150D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.99565 |
| 30 +: | $ 2.91480 |
| 50 +: | $ 2.75285 |
| 100 +: | $ 2.59094 |
| 250 +: | $ 2.42903 |
| 500 +: | $ 2.34806 |
| 1000 +: | $ 2.10516 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.590" (15.00mm) |
| Width: | 0.590" (15.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.20°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal-heat sinks have been an integral part of electronics since the development of integrated circuits in the 1950s. The ATS-54150D-C0-R0 is a high-performance thermal-heat sink designed to provide maximum cooling for high-speed processors and other electronics. In this article, we will discuss the application field and working principle of the ATS-54150D-C0-R0.
The ATS-54150D-C0-R0 thermal-heat sink is a low-profile, one-piece aluminum spreader design with a nominal fin density of 42 fins-per-inch (FPI). This high-performance heat sink provides excellent cooling capabilities in a small form factor, making it ideal for applications where space is limited. The spreader fin design also provides good thermal performance, which is critical for thermal-efficient operation of today’s high-speed processors.
The ATS-54150D-C0-R0 heat sink also features a high-mass thermal-cooling base, which helps to improve its thermal performance. The heat sink comes with a 6-inch long, 2-inch thick extruded aluminum base plate, which transfers heat away from the mounting surfaces to the fins. This base plate is coated with a special thermal-transfer compound, which helps to further improve the device’s thermal performance. The heat sink also includes two 0.5-inch copper tubes for additional cooling.
The ATS-54150D-C0-R0 thermal-heat sink works by attaching the device to the component to be cooled. The heat sink then transmits heats through the fins and base plate to the air around it. As air passes over the fins, it carries away the heat energy, cooling the component. The copper tubes on the heat sink provide additional heat transfer by dissipating heat from the base of the component. A fan can be attached to the heat sink to improve cooling.
The ATS-54150D-C0-R0 thermal-heat sink is designed for use in a wide range of high-speed electronic components, including processors, video cards, and other power-hungry electronics. The heat sink has seen great success in high-performance gaming and virtual reality components, as well as in medical equipment. Its small form factor and excellent thermal performance make it a great choice for tight spaces. The heat sink is also designed to be easily integrated into any system, and is UL and CSA certified.
The ATS-54150D-C0-R0 thermal-heat sink is an excellent choice for any application where maximum cooling is required. Its low-profile aluminum spreader design and high-mass thermal-cooling base provide excellent cooling capabilities in a small form factor. The device is also UL and CSA certified, making it a great choice for a variety of applications. Whether you need to cool a processor, a video card, or some other high-performance electronic component, the ATS-54150D-C0-R0 is a great choice.
The specific data is subject to PDF, and the above content is for reference