| Allicdata Part #: | ATS-54190D-C0-R0-ND |
| Manufacturer Part#: |
ATS-54190D-C0-R0 |
| Price: | $ 3.37 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 19X19X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54190D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.05550 |
| 30 +: | $ 2.97276 |
| 50 +: | $ 2.80753 |
| 100 +: | $ 2.64235 |
| 250 +: | $ 2.47724 |
| 500 +: | $ 2.39466 |
| 1000 +: | $ 2.14693 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.748" (19.00mm) |
| Width: | 0.748" (19.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important part of effective operation of electronics. The use of heat sinks help to eliminate excess heat produced by components on the circuit board, and this helps to keep electronic devices stable and running efficiently. The advanced thermal solutions manufacturing company ATS-54190D-C0-R0 provides a cutting edge product in this domain – the ATS-54190D-C0-R0 heat sink.
The ATS-54190D-C0-R0 is a high performance fan-less heat sink with an ultra smooth surface. It is ideal for applications that require fanless operation, and offers excellent levels of noise reduction and thermal performance. The heat sink is designed to work with a wide range of processor and SoC packages, and it has an impressive heat dissipation capacity. It is also compatible with a variety of cooling solutions including air and liquid cooling.
The ATS-54190D-C0-R0 features an innovative curved design which allows for better air flow and higher heat dissipation. It also has an easy-to-remove snap-on base for quick installation and removal. The thermal conductive silicone-based material used to make the heat sink ensures the product is capable of dissipating large amounts of heat without compromising its performance or efficiency.
The working principle of the ATS-54190D-C0-R0 heat sink is simple. Heat is generated by components in an electronic device, and this heat needs to be dissipated away from the device in order to maintain stable operation. The ATS-54190D-C0-R0 uses heat conduction to transfer the heat away from the components and dissipate it into the air. As the heat sink has an ultra-smooth surface, it is able to transfer the heat away easily, and this helps to keep the device operational without causing any performance issues.
The ATS-54190D-C0-R0 is a great choice for applications such as tablets, laptops, or other mobile-based devices. It is especially useful for devices that are used for long periods of time, as the heat sink helps to ensure the electronics remain protected from excess heat. As the heat sink is fan-less, it is also ideal for applications that require quiet operation. The product is also highly efficient and reliable, and provides users with a solution that is easy to install and maintain.
The ATS-54190D-C0-R0 heat sink is an excellent choice for applications that require high levels of thermal management and cooling solutions. Its innovative curved design allows for better air flow, and its ultra-smooth surface provides efficient heat dissipation. The product is also compatible with a variety of cooling solutions including air and liquid cooling, making it an ideal choice for a wide range of applications. The ATS-54190D-C0-R0 is an excellent solution for those looking for an efficient and reliable heat sink that can offer superior performance and stability.
The specific data is subject to PDF, and the above content is for reference