| Allicdata Part #: | ATS-54230D-C0-R0-ND |
| Manufacturer Part#: |
ATS-54230D-C0-R0 |
| Price: | $ 3.42 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 23X23X9.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum 0.3W @ 20°C Top Mount |
| DataSheet: |  ATS-54230D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.11472 |
| 30 +: | $ 3.03051 |
| 50 +: | $ 2.86209 |
| 100 +: | $ 2.69375 |
| 250 +: | $ 2.52542 |
| 500 +: | $ 2.44124 |
| 1000 +: | $ 2.18870 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.900" (23.00mm) |
| Width: | 0.906" (23.01mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | 0.3W @ 20°C |
| Thermal Resistance @ Forced Air Flow: | 16.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal heat sinks, which are an integral part of electronics cooling, are devices designed to heat by the transfer of thermal energy from hot surfaces to cooler liquids or air. ATS-54230D-C0-R0 is an example of a thermal heat sink, and its applications and working principle are discussed in detail below.
The ATS-54230D-C0-R0 thermal heat sink is a heavy-duty all-black aluminum heat sink designed for cooling many types of electronic devices. This heat sink has a high thermal conductivity rating of 8.7 W/mK and a thermal resistance rating of 0.12 °C/W. This allows it to effectively transfer heat away from any application, making it an ideal choice for a variety of applications.
The ATS-54230D-C0-R0 thermal heat sink is commonly used in applications such as automotive electronics, industrial electronics, control systems, domestic electronics, medical electronics, and many more. In each of these applications, the thermal heat sink is used to minimize the thermal resistance between the super-hot components and the surrounding environment. By doing so, the overall system temperature is reduced, which helps to ensure that the components run at their optimal temperature.
The working principle of the ATS-54230D-C0-R0 thermal heat sink is based on the principle of thermal conduction. When a hot surface is in contact with a cooler liquid or air, the heat from the surface is transferred to the cooler medium, and the temperature of the surface decreases. This process ensures that the components of an electronic system remain cool throughout its operation.
The ATS-54230D-C0-R0 thermal heat sink also features a U-shaped design. This design allows for greater surface area contact between the heat sink and the components, and it also allows for improved air flow between the surrounding environment and the component. This improved air flow helps to optimize the cooling capabilities of the heat sink and ensure that the components running at an optimal temperature.
The ATS-54230D-C0-R0 thermal heat sink also features a mounting method that is both efficient and secure. The heat sink can be securely mounted in place using push-through posts that ensure strong and secure installation. This ensures that the heat sink will remain firmly in place and will provide optimal cooling performance.
In conclusion, the ATS-54230D-C0-R0 thermal heat sink is a highly effective device that is designed to efficiently transfer thermal energy from hot surfaces to cooler liquids or air. This helps to keep the components running at their optimal temperatures and improves the overall performance of the system. The U-shaped design and secure mounting method also ensures that the heat sink will remain firmly in place and provide optimal cooling performance. Thus, the ATS-54230D-C0-R0 thermal heat sink can be an invaluable addition to any electronic system.
The specific data is subject to PDF, and the above content is for reference