| Allicdata Part #: | ATS-54250R-C0-R0-ND |
| Manufacturer Part#: |
ATS-54250R-C0-R0 |
| Price: | $ 4.41 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X19.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54250R-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.96711 |
| 30 +: | $ 3.74703 |
| 50 +: | $ 3.52661 |
| 100 +: | $ 3.30618 |
| 250 +: | $ 3.08577 |
| 500 +: | $ 2.86535 |
| 1000 +: | $ 2.81025 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.70°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-54250R-C0-R0 Thermal - Heat Sink is designed with high efficiency in mind. It is designed to deliver ambient temperature air to electronics and devices at low, safe temperatures without the need for costly equipment.
The ATS-54250R-C0-R0 Thermal - Heat Sink is a finned aluminum or copper heat sink that is designed to dissipate heat away from the device or component it is attached to. Heat is conducted away from the component or device via a finned heat sink and is then channeled away into the ambient environment by convective or forced air flow.
The ATS-54250R-C0-R0 Thermal - Heat Sink is the perfect solution for multiple applications, from automotive components and industrial devices to lab equipment and consumer products. It is designed for applications that require a large cooling capacity and can be adapted to meet the unique needs of the application.
To achieve its cooling capacity, the ATS-54250R-C0-R0 Thermal - Heat Sink relies on a clever layer of finned heat sinks that are connected in parallel. Each fin is designed to draw heat away from the device or component and guide it away from the surface where it can be channeled out of the environment through proper air-flow channels.
The ATS-54250R-C0-R0 Thermal - Heat Sink also features a positive pressure chamber that forces air to move along the finned layers, ensuring that heat is constantly being drawn away from the surface of the device or component. This helps to ensure that the temperature of the surface remains consistent, avoiding any fluctuations that may lead to reduced performance or, worse, component failure.
Another benefit of the ATS-54250R-C0-R0 Thermal - Heat Sink is the fact that it is designed to fit a variety of cooling requirements. This means that the cooling requirements of different types of products can be accommodated just by adjusting the size of the heat sink. The finned design is also adjustable, allowing for specific fin structures to be customized to specific cooling applications.
In addition, the ATS-54250R-C0-R0 Thermal - Heat Sink is designed with durability in mind. The fins are designed to be able to dissipate heat efficiently for an extended period of time. This means that the customer will not have to replace the heat sink for a long time, ensuring that the cost-effectiveness of the component over time.
Overall, the ATS-54250R-C0-R0 Thermal - Heat Sink is an efficient and cost effective way to cool multiple applications. The easy to adjust fin design ensures that temperatures of the device or component are maintained and that the product runs for extended periods of time without interruption. Furthermore, the adjustable fin and positive pressure chamber gives the customer the flexibility to customize the heat sink to suit specific cooling requirements.
The specific data is subject to PDF, and the above content is for reference