ATS-54250W-C0-R0 Allicdata Electronics
Allicdata Part #:

ATS-54250W-C0-R0-ND

Manufacturer Part#:

ATS-54250W-C0-R0

Price: $ 5.26
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X24.5MM W/OUT TIM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-54250W-C0-R0 datasheetATS-54250W-C0-R0 Datasheet/PDF
Quantity: 8
1 +: $ 4.73130
10 +: $ 4.60341
25 +: $ 4.34776
50 +: $ 4.09210
100 +: $ 3.83632
250 +: $ 3.58057
500 +: $ 3.32481
1000 +: $ 3.26087
Stock 8Can Ship Immediately
$ 5.26
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.965" (24.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.40°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are a critical component in the efficiency of many electronic systems. The ATS-54250W-C0-R0 heat sink is a great example of the complex engineering necessary to maximize efficiency and reliability in modern systems. This article will focus on the application fields and working principles of the ATS-54250W-C0-R0 heat sink.

Applications

The ATS-54250W-C0-R0 heat sink is a popular choice for modern applications, including automotive, consumer electronics, renewable energy, industrial, military, and other applications. The slim profile and light weight of the device makes it easy to install in tight spaces. Additionally, its high thermal insulation ensures that components do not overheat.

The ATS-54250W-C0-R0 heat sink is designed to dissipate heat quickly and efficiently. This is due to its robust aluminum fin construction and sophisticated design. The fins are designed to increase heat dissipation while remaining aerodynamic and lightweight. As a result, the heat sink can operate in a wide range of temperatures and can still quickly dissipate heat.

Working Principle

The ATS-54250W-C0-R0 heat sink uses convective heat transfer to dissipate heat into the environment. This is accomplished by creating a large surface area for heat to transfer from a hot component to a cooler environment. The fins of the heat sink allow air to flow freely and efficiently dissipate the heat away.

The ATS-54250W-C0-R0 heat sink is designed to be thermally efficient. It is able to achieve this through its unique construction. The outer shell is made of aluminum alloy that transfers heat quickly, and the inside fins are designed to dissipate heat quickly. Furthermore, the aluminum fins are spaced evenly to maximize the surface area of the heat sink.

In addition, the ATS-54250W-C0-R0 heat sink features an effective internal heat pipe system. These heat pipes are designed to quickly transfer heat away from the hot component in order to reduce overheating. The heat pipes are able to transfer the heat away quickly due to its strong aluminum construction.

The ATS-54250W-C0-R0 heat sink also features a temperature sensor. This sensor is able to provide feedback on the temperature of the component that is being cooled by the heat sink. This will alert the user when the component is getting too hot and needs to be cooled down.

Conclusion

The ATS-54250W-C0-R0 heat sink is a thermally efficient and reliable way to dissipate heat in a wide variety of applications. Its slim profile and light weight make it suitable for installation in tight spaces. Additionally, its aluminum construction and heat pipe system ensure it can dissipate heat quickly and efficiently. Finally, its temperature sensor provides feedback to the user when the component is getting too hot. Therefore, the ATS-54250W-C0-R0 heat sink is an ideal option for many modern applications.

The specific data is subject to PDF, and the above content is for reference

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