| Allicdata Part #: | ATS1201-ND |
| Manufacturer Part#: |
ATS-54270D-C1-R0 |
| Price: | $ 3.88 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 27MM X 27MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54270D-C1-R0 Datasheet/PDF |
| Quantity: | 3729 |
| 1 +: | $ 3.52800 |
| 10 +: | $ 3.43728 |
| 25 +: | $ 3.34429 |
| 50 +: | $ 3.15857 |
| 100 +: | $ 2.97278 |
| 250 +: | $ 2.78699 |
| 500 +: | $ 2.69410 |
| 1000 +: | $ 2.41539 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-54270D-C1-R0 is a thermal solution that helps dissipate excess heat from electronic components to keep them functioning properly. Thermal solutions, such as the ATS-54270D-C1-R0, are often used in high-power, high-heat applications, such as in power supplies, storage systems, automotive, telecommunications and other applications.
ATS-54270D-C1-R0 belongs to the category of Thermal - Heat Sinks, which are highly efficient heat exchangers designed to dissipate thermal energy from one surface to the other. Heat sinks consist of a network of thin metal fins that effectively increase the surface area of the device. The fins increase the surface area of the device, allowing for more efficient dissipation of heated air. Heat sinks are typically composed of any combination of Fin material such as copper, aluminum, solder, and graphite.
The ATS-54270D-C1-R0 is a finned heat sink, constructed with aluminum alloy and features a small fin density, low profile design for use in areas where space is at a premium. The heat-sink\'s thin fins help to increase the surface area of the device, which allows for improved heat dissipation. The fins are also designed with a special curved cross-sectional profile, which helps to increase air flow across the surface of the device. This provides efficient heat transfer, which helps to keep the device at an ideal temperature for efficient operation.
To enhance its efficiency, the ATS-54270D-C1-R0 is equipped with an heat spreader plate, which is placed between the heat sink and the device, and acts as a secondary heat sink. The heat spreader plate helps to spread the heat generated from the device, to different parts of the heat sink, improving the overall thermal transfer between the two components. In addition to this, the ATS-54270D-C1-R0 is also equipped with a thermal tape for better heat transfer between the heat sink and the device.
The ATS-54270D-C1-R0 is easy to use and install, requiring minimal installation time. It can be easily mounted on the device to be cooled using standard mounting systems. The heat sink also features an easy to remove copper mounting bracket, which makes replacing and cleaning the heat sink easy for maintenance purposes. Additionally, the assembled heat sink also includes thermal grease, which helps to ensure optimal heat transfer.
The ATS-54270D-C1-R0 is an excellent thermal solution for a variety of applications, such as embedded systems, automotive, power systems, data centers, and many other industrial applications. Its exceptional thermal performance, small size, and easy installation make it an ideal solution for any thermal product.
The specific data is subject to PDF, and the above content is for reference