| Allicdata Part #: | ATS-54270K-C0-R0-ND |
| Manufacturer Part#: |
ATS-54270K-C0-R0 |
| Price: | $ 4.03 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 27X27X14.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54270K-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.66660 |
| 30 +: | $ 3.46290 |
| 50 +: | $ 3.25924 |
| 100 +: | $ 3.05556 |
| 250 +: | $ 2.85186 |
| 500 +: | $ 2.64816 |
| 1000 +: | $ 2.59723 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 1.063" (27.00mm) |
| Width: | 1.063" (27.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management is a critical component in the operation of many electronics. Heat sinks are one of the most common solutions to this problem, used to dissipate the heat generated by a system or component. The ATS-54270K-C0-R0 is a particular type of heat sink designed to perform its thermal management functions with exceptional efficiency.
The ATS-54270K-C0-R0 is a thermoelectric aluminum heat sink with anodization coating and low thermal resistance. It consists of a base made from aluminum alloy press-formed and extruded sections, which features a curved surface design intended to reduce surface thermal resistance. The base surface is laser engraved to ensure a perfect fit to the component requiring cooling.
The heat sink is attached to the component by using thermal interface material (TIM) or other suitable adhesive. It is designed to handle temperatures up to 140°C, and is suitable for high-speed, high-load applications. The thermoelectric characteristics of the ATS-54270K-C0-R0 allow for efficient cooling even in heavily populated boards or tight spaces.
The ATS-54270K-C0-R0 is designed for numerous applications, such as applications in consumer, industrial, and automotive electronics. It is suitable for cooling components such as ASIC, GPU, microprocessors, and other high-power components. This heat sink has been used in projects ranging from robotics to battery packs, and is suitable for a variety of environments.
The working principle of the ATS-54270K-C0-R0 is based on thermoelectric cooling. As electric current passes through the heat sink, heat is generated and carried away from the component. The heat is then dissipated by the aluminum fins which act as radiators by transferring the heat to the ambient air. As the current passes through the heat sink, a temperature differential is created, allowing for a cooling effect.
The ATS-54270K-C0-R0 is an efficient and reliable thermal management solution, capable of handling a wide range of temperatures and loads. Its versatility, low thermal resistance, and robust construction make it an excellent choice for a variety of applications requiring efficient cooling. This heat sink is an ideal choice for those looking for a reliable and efficient way to manage heat in their electronic systems.
The specific data is subject to PDF, and the above content is for reference