| Allicdata Part #: | ATS-54290K-C0-R0-ND |
| Manufacturer Part#: |
ATS-54290K-C0-R0 |
| Price: | $ 4.07 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 29X29X14.5MM W/OUT TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54290K-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.70125 |
| 30 +: | $ 3.49566 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management systems often use heat sinks to draw thermal energy away from an object or component to protect it from excessive heat and maintain its operational lifespan. The ATS-54290K-C0-R0 is a high-performance heat sink designed to increase the thermal transfer rate between a component and its environment by providing maximum dissipating surface area and improved internal airflow.
The ATS-54290K-C0-R0 heat sink features an aluminum base and fins for optimal thermal efficiency. Its design allows for maximum air movement, while at the same time providing a low-profile form factor for limited space facilities. Additionally, an integrated heat spreader plate is designed to distribute the thermal load more evenly across the sink surface. The high-performance design ensures uniform thermal handling along the entire substrate.
The ATS-54290K-C0-R0 heat sink is ideal for a wide range of applications, including buck converters, power amplifiers, power management circuits, and laser diodes. The heat sink performance is further enhanced through its robust aluminum construction, which offers high corrosion-resistance and thermal conductivity, allowing the heat sink to be used in a wide range of environments. Additionally, the heat sink includes various mounting options for secure installation on a variety of substrates.
The ATS-54290K-C0-R0 heat sink features a unique design that promotes optimal thermal transfer. Its base and fins are constructed from high-grade aluminum alloy, allowing for maximum thermal transfer. Additionally, the design features staggered fins, which helps to break up laminar air flow and create turbulence for improved thermal performance. The integrated heat spreader plate helps to evenly distribute thermal load and ensures uniform thermal performance across the substrate surface.
The ATS-54290K-C0-R0 heat sink is designed for reliable operation in a wide range of applications, including power management circuits, buck converters, laser diodes, and power amplifiers. The construction materials allow the heat sink to be used in a wide range of environments, and the efficient design is compatible with most substrates. The high-performing design is optimized for maximum thermal transfer rate so the object or component can achieve its ideal operating temperature.
The specific data is subject to PDF, and the above content is for reference