| Allicdata Part #: | ATS1219-ND |
| Manufacturer Part#: |
ATS-54290K-C1-R0 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 29MM X 29MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54290K-C1-R0 Datasheet/PDF |
| Quantity: | 98 |
| 1 +: | $ 4.10760 |
| 10 +: | $ 3.99735 |
| 25 +: | $ 3.77521 |
| 50 +: | $ 3.55307 |
| 100 +: | $ 3.33106 |
| 250 +: | $ 3.10897 |
| 500 +: | $ 2.88690 |
| 1000 +: | $ 2.83137 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat sinks are a type of electronics that are used in various applications to help manage heat and dissipate it away from a certain area or piece of equipment. The ATS-54290K-C1-R0 is a particular heat sink that is designed for thermal management applications.
The ATS-54290K-C1-R0 thermal heat sink features a base aluminum alloy construction with fan fin thermal design. This design incorporates fan fins which are cast from its bottom and nested together to allow for an efficient heat dissipation. The fan fin design of the ATS-54290K-C1-R0 is designed to maximize heat dissipation efficiency, which helps reduce the total operating temperature of any device or equipment to which it is attached.
The primary application of the ATS-54290K-C1-R0 thermal heat sink is for cooling various types of electronics including computers, computer peripherals, LCD displays, TVs, AV receivers, etc. Due to its fan fin design, it is able to dissipate heat quickly and efficiently, which keeps the device cool and performing optimally. It is also ideal for components that need to stay cool while running high levels of power.
The working principle of the ATS-54290K-C1-R0 thermal heat sink is simple in that it uses aluminum alloys and fan fins to dissipate heat away from an electronic device. The fan fins are designed to force the heat away from the device using airflow created by air moving across them. This helps to cool the device as the fan fins create an efficient cooling system. Additionally, the metal alloy of the heat sink helps to conduct heat away from the device, which further helps to reduce the operating temperature of the device.
The ATS-54290K-C1-R0 thermal heat sink also features thermally grease pre-applied to its surfaces. This allows for a more efficient heat transfer rate between the device and the heat sink, further aiding in the cooling of the device. Additionally, the heat sink also has a long lifespan and is able to withstand extended periods of use without needing to be replaced.
The ATS-54290K-C1-R0 thermal heat sink is designed for maximum efficiency and reliability, making it an ideal choice for any cooling application. With its aluminum alloy construction and fan fin design, it is able to dissipate heat quickly and efficiently, making it an ideal cooling solution for any type of device. It also features pre-applied thermally grease for increased heat transfer efficiency and a long lifespan or durability.
The specific data is subject to PDF, and the above content is for reference