ATS-54290R-C0-R0 Allicdata Electronics
Allicdata Part #:

ATS-54290R-C0-R0-ND

Manufacturer Part#:

ATS-54290R-C0-R0

Price: $ 4.50
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 29X29X19.5MM W/OUT TIM
More Detail: Heat Sink BGA Aluminum Top Mount
DataSheet: ATS-54290R-C0-R0 datasheetATS-54290R-C0-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.04838
30 +: $ 3.82347
50 +: $ 3.59856
100 +: $ 3.37365
250 +: $ 3.14874
500 +: $ 2.92383
1000 +: $ 2.86761
Stock 1000Can Ship Immediately
$ 4.5
Specifications
Series: --
Part Status: Active
Type: Top Mount
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Shape: Square, Fins
Length: 1.142" (29.00mm)
Width: 1.142" (29.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.768" (19.50mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Black Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential for all electronic devices, and heat sinks are an important part of it. AAT-54290R-C0-R0 heat sink is one of the most popular thermal solutions for a variety of industry applications. This article will introduce its application fields, working principle and performance.

Applications

The AAT-54290R-C0-R0 heat sink is mainly used in applications such as microwave ovens, controllers, remote sensing devices, medical equipments, communications and military equipments, where excellent heat dissipation and thermal management are essential. It is also suitable for industrial automation, CNC machines and other applications.

Working Principle

The AAT-54290R-C0-R0 heat sink features a high-performance heat dissipation structure. It consists of a black anodized aluminum fin that provides an even surface for heat transfer. The fin is designed to increase the surface area for heat dissipation, and allows air to circulate freely around the fin and efficiently carry away the heat. The passive cooler is designed with a copper base and allows a maximum air flow rate of 0.28m/s.

Performance

The AAT-54290R-C0-R0 heat sink offers excellent thermal management and cooling performance. The fin area is designed to increase the contact area with heat sources, which further increases heat dissipation efficiency. The optimal fin size and design ensure a balance between pressure drops and air flow rate. Its low thermal resistance and high performance makes it an ideal choice for cooling applications with limited space. With a maximum power rating of 160W, the AAT-54290R-C0-R0 heat sink offers a high-efficiency cooling solution in compact applications. It can also operate in environments with up to 95% relative humidity, making it suitable for use in extreme conditions. The heat sink is designed to provide a long working life in harsh environments, and can withstand temperatures up to 85°C. The AAT-54290R-C0-R0 heat sink is an ideal choice for applications where fast thermal solution is required. Its high-performance heat dissipation structure helps minimize temperature rise and maintain optimal operating temperatures for electronic components. The low cost and compact size make it an ideal thermal solution for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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