Allicdata Part #: | ATS1236-ND |
Manufacturer Part#: |
ATS-54290R-C1-R0 |
Price: | $ 5.00 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 29MM X 29MM X 19.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-54290R-C1-R0 Datasheet/PDF |
Quantity: | 14 |
1 +: | $ 4.49820 |
10 +: | $ 4.37535 |
25 +: | $ 4.13204 |
50 +: | $ 3.88912 |
100 +: | $ 3.64600 |
250 +: | $ 3.40293 |
500 +: | $ 3.15986 |
1000 +: | $ 3.09910 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Fins |
Length: | 1.142" (29.00mm) |
Width: | 1.142" (29.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.768" (19.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
In the electronic components industry, thermal - heat sinks are used to provide thermal protection and maximize performance of electronics, and ATS-54290R-C1-R0 is an example of the many heat sinks capable of providing reliable thermal management. This heat sink is ideal for applications requiring increased performance and power setting limits, as well as enhanced thermal stability. In this article, we will discuss the application field and working principle of ATS-54290R-C1-R0 heat sinks.
Heat sinks are used in a variety of electronic applications, ranging from computing and telecommunications to audio and video. Heat sinks are also used in artificial intelligence, industrial automation, and military applications. In particular, ATS-54290R-C1-R0 heat sinks are designed for applications where space is limited and weight is critical. This heat sink is designed to optimize thermal management with its low profile design, while enabling you to save space.
The working principle of the ATS-54290R-C1-R0 heat sink is mainly based on active heat transfer. The heat sink’s finned design optimizes air flow and allows for efficient cooling. Heat from the central processor is removed by passing through the heat sink’s base to the fins, allowing it to be easily dissipated into the surrounding environment. This active cooling method is more efficient than standard heat pipes or fans.
The ATS-54290R-C1-R0 heatsink can also be used on motherboards and other circuit boards that require increased power settings and require thermal stability. This heat sink works by transferring heat from its base and fins to the surrounding air. The heat dissipates into the air, but can actually cause electrical issues if it is not properly dissipated. The heat sink’s fins and its base are specifically designed to ensure proper heat dissipation, in addition to providing efficient active cooling.
The ATS-54290R-C1-R0 heat sink is also designed to resist the effects of vibration, shock, and other physical stresses. The heat sink’s outer frame is coated with a flexible thermoplastic, reinforced with a steel core. This helps to minimize any physical stress and helps to provide a long service life. Additionally, the heat sink’s fins are also oriented to ensure adequate heat dissipation, while also allowing for efficient active cooling.
The ATS-54290R-C1-R0 heat sink offers reliable thermal protection, and is ideal for use in tight spaces or applications with weight constraints. This heat sink’s active cooling design helps to ensure adequate heat dissipation, and its outer frame offers protection from physical stress. This heat sink is also designed to resist the effects of vibration and shock, ensuring a long service life. With these features, ATS-54290R-C1-R0 heat sinks are the perfect choice for any application.
The specific data is subject to PDF, and the above content is for reference