| Allicdata Part #: | ATS1253-ND |
| Manufacturer Part#: |
ATS-54290W-C1-R0 |
| Price: | $ 4.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 29MM X 29MM X 24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54290W-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 100 +: | $ 4.27008 |
| 300 +: | $ 3.98540 |
| 500 +: | $ 3.70073 |
| 1000 +: | $ 3.62957 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.142" (29.00mm) |
| Width: | 1.142" (29.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.80°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks are essential when it comes to high-performance cooling. Over the years, advancements in thermal solutions have led to the development of the ATS-54290W-C1-R0 solution, a highly efficient and effective solution to reduce thermal resistance and power dissipation requirements.
The ATS-54290W-C1-R0 solution is an active-cooling package that uses a copper heat spreader to dissipate heat from the heat generating components into a surrounding air. Its curved shape allows it to move the heat across its surface area providing better cooling performance. The heat spreader is combined with a small fan and a heat sink to further increase the efficiency of the thermal solution.
The ATS-54290W-C1-R0 is able to dissipate heat up to 1120 watts of heat with its cooling fan running at 4500 rpm. This solution is designed for higher power applications such as high watt LED’s, CPUs, GPUs, and other processors. The ATS-54290W-C1-R0 also offers improved durability and reliability compared to other cooling solutions, making it a great choice for long-term use.
The working principle of the ATS-54290W-C1-R0 lies in its ability to convert the thermal energy generated by the components into electrical energy. This is done through a process called heat dissipation. This occurs when the device is exposed to high temperatures, which cause the heat to move from the heat generating components to the heat sink. The heat sink then dissipates the heat to its surroundings, thus lowering the overall temperature.
In addition to the basic cooling technology of the ATS-54290W-C1-R0, many companies have developed additional features to improve the thermal performance. Various types of alloy heat sinks, fans, and additional components are designed to keep up with the changing industry regulations and increases in the thermal requirements of modern power consumption. This ensures that the ATS-54290W-C1-R0 is able to perform and maintain steady temperatures in the most extreme applications.
The application field for the ATS-54290W-C1-R0 is wide ranging. From consumer electronics to industrial applications, the thermal solution is used to cool mobile phones, media players, game consoles, display devices, and other heat-generating components. The device is also used to reduce power dissipation in semiconductor and LED chips, which helps to improve module yield. In addition, the thermal solution is also an effective choice in controlling heat in commercial and industrial applications.
The ATS-54290W-C1-R0 is a highly efficient and effective active thermal solution that is designed for high performance cooling. With its unique design and ability to dissipate large amounts of heat it is an excellent choice for applications that require reliable cooling performance. It is an ideal solution for applications that require long-term stability and improved durability, making it a great selection for any IT environment.
The specific data is subject to PDF, and the above content is for reference