| Allicdata Part #: | ATS1220-ND |
| Manufacturer Part#: |
ATS-54300K-C1-R0 |
| Price: | $ 4.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 30MM X 30MM X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54300K-C1-R0 Datasheet/PDF |
| Quantity: | 174 |
| 1 +: | $ 4.15800 |
| 10 +: | $ 4.04334 |
| 25 +: | $ 3.81856 |
| 50 +: | $ 3.59377 |
| 100 +: | $ 3.36924 |
| 250 +: | $ 3.14461 |
| 500 +: | $ 2.91999 |
| 1000 +: | $ 2.86383 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of power systems is critical for prolonging the life and performance of components. Heat sinks are an important part of thermal management and are used to dissipate heat away from components and cool them to a safe operating temperature. The ATS-54300K-C1-R0 heat sink is an ideal choice for cost effective and efficient thermal management.
The ATS-54300K-C1-R0 is a vertical aluminum finned heat sink. It is designed to be mounted using a clip system and is suitable for surface mounting on equipment and other thermally demanding applications. The clip system is a quick and easy way to mount the heat sink and makes for a secure connection. The heat sink is ideal for applications with high dissipation requirements due to its vertical fins. The fins allow for efficient heat transfer from the component to the ambient environment, ensuring that the components remain at an optimal temperature. Additionally, the high surface area of the fins provides a large area for heat exchange, allowing for maximum heat transfer from the component to the ambient environment.
The ATS-54300K-C1-R0 is designed to be used with components that generate significant amounts of heat, such as microcontrollers, DSPs, CPUs, FPGAs, Processors, Memory and RF transceivers. It works by dissipating the heat generated away from the components and cooling them to a safe operating temperature. The heat is absorbed by the vertical fins and the heat then dissipates outward. This allows the heat to be dispersed away from the components and prevents the components from reaching dangerously high temperatures. The ATS-54300K-C1-R0 has been tested and certified to UL and CE standards, making it a safe and reliable heat sink for thermal management applications.
The ATS-54300K-C1-R0 is an ideal solution for cost effective and efficient heat management. Its vertical fins enable efficient heat transfer from the component to the ambient environment, preventing it from reaching dangerous temperatures. Additionally, its quick-mount clip system makes for a fast and secure installation. The ATS-54300K-C1-R0 is tested and certified to UL and CE standards, making it a reliable and safe choice for thermal management applications.
The specific data is subject to PDF, and the above content is for reference