| Allicdata Part #: | ATS1204-ND |
| Manufacturer Part#: |
ATS-54310D-C1-R0 |
| Price: | $ 3.89 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 31MM X 31MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54310D-C1-R0 Datasheet/PDF |
| Quantity: | 576 |
| 1 +: | $ 3.54060 |
| 10 +: | $ 3.44736 |
| 25 +: | $ 3.25584 |
| 50 +: | $ 3.06445 |
| 100 +: | $ 2.87293 |
| 250 +: | $ 2.68138 |
| 500 +: | $ 2.48985 |
| 1000 +: | $ 2.44196 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.220" (30.99mm) |
| Width: | 1.220" (30.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is vital in order to ensure optimum performance of electrical products and to maximise long-term reliability. Heat generated by electronic components must be dissipated properly in order to prevent the product from overheating and ultimately failing. Heat sinks are an essential thermal management solution for this purpose, and the ATS-54310D-C1-R0 is an excellent example of these products.
The ATS-54310D-C1-R0 is a feature-filled thermally managed device designed to provide efficient heat dissipation. It is manufactured from black anodised aluminium with a thin-film layer of polysilicon which is bonded to the fins to increase surface area and hence improve thermal conduction. The device features a flat base with a cavity that houses multiple heat dissipating pins which act to increase the rate of heat dissipation. The combination of the thin-film and pins results in a very efficient heat dissipation solution while still ensuring that the device is compact in size.
Given the high efficiency of the ATS-54310D-C1-R0, it is suitable for a range of applications. Firstly, it can be used to cool high-powered components such as processors and graphics cards, as well as providing an effective way of dissipating the heat generated by the dissipating elements of low-power components. Secondly, this device can also be used to dissipate heat from multiple sources simultaneously, making it a suitable choice for integrated systems that require cooling multiple components.
Furthermore, due to its small size, the ATS-54310D-C1-R0 is ideal for use in tight spaces. It is perfect for applications where there is limited space for bulky cooling solutions, such as in embedded or mobile systems. In addition, this device is also well suited for use in high-temperature environments due to its excellent thermal conduction properties. This makes the ATS-54310D-C1-R0 suitable for both commercial and industrial applications.
The working principle of the ATS-54310D-C1-R0 is based on an efficient heat spreading system. Heat from the component is spread by a combination of the heat dissipating pins and the thin-film layer and this heat is then carried away by airflow, allowing the component to be kept cool and work at its optimum operational efficiency. The device also significantly reduces the heat bleed away from the component, allowing for higher temperatures to be reached without the risk of thermal failure.
The ATS-54310D-C1-R0 is a well designed device from a well established name that offers reliable, efficient heat dissipation. Its combination of efficient thermal conduction, compact size and multiple heat dissipating fins make it a suitable choice for a wide range of applications including industrial, commercial and embedded systems. As a result, the ATS-54310D-C1-R0 is becoming one of the most popular thermal management solutions on the market.
The specific data is subject to PDF, and the above content is for reference