| Allicdata Part #: | ATS-54325D-C0-R0-ND |
| Manufacturer Part#: |
ATS-54325D-C0-R0 |
| Price: | $ 3.64 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 32.5X32.5X9.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54325D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.30498 |
| 30 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
The ATS-54325D-C0-R0 heat sink is a piece of lightweight, aluminum metal technology to dissipate heat away from sensitive components. It plays an essential role in minimizing problems caused by overheating, while allowing systems to run as efficiently as possible. This article provides a detailed exploration of the ATS-54325D-C0-R0 heat sink application field and working principle.
Application Field
The ATS-54325D-C0-R0 heat sink is suitable for a range of applications, including those in aerospace, transportation and consumer electronics. It is perfect for portable battery-powered devices that must be kept cool even during periods of intense activity, such as when running games or streaming videos. This heat sink is also able to handle heavier workloads and more energy-intensive applications and can even increase the performance and efficiency of the device it is installed in.
The ATS-54325D-C0-R0 is designed for applications that require efficient thermal control. It is perfect for applications such as processors, controllers, and other mission-critical components. It is also ideal for a number of industrial and consumer applications, such as televisions, home theaters, refrigeration systems, and industrial robots. This heat sink can handle both short and long-term high-temperature applications.
Working Principle
The ATS-54325D-C0-R0 heat sink utilizes a clever combination of thin aluminum fins and highly- reflective metal surfaces to transfer heat from the device to the outside. Heat is transferred from the device by the fins, which alternate between highly-reflective and heat-absorbing surfaces. The alternating surface temperatures ensure that the device runs as efficiently as possible, as the heat from the fins is dissipated away into the atmosphere.
The fins on the ATS-54325D-C0-R0 provide increased thermal efficiency by increasing surface area. The more surface area available, the more effective the heat sink will be at absorbing and dissipating away heat. Additionally, the heat sink\'s design promotes airflow, which further increases the rate of heat dissipation. The airflow created also helps to remove any warm air and moisture that could act as a barrier to thermal dissipation.
The ATS-54325D-C0-R0 heat sink is an essential component for devices that require efficient cooling. Its combination of lightweight metal, highly reflective surfaces and increased surface area make it perfect for high-temperature applications, while the airflow it creates helps to remove any excess warm air. This thermal efficiency allows systems to run smoothly and efficiently.
The specific data is subject to PDF, and the above content is for reference