| Allicdata Part #: | ATS1205-ND |
| Manufacturer Part#: |
ATS-54325D-C1-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 32.5 X 32.5 X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54325D-C1-R0 Datasheet/PDF |
| Quantity: | 842 |
| 1 +: | $ 3.57840 |
| 10 +: | $ 3.48201 |
| 25 +: | $ 3.28835 |
| 50 +: | $ 3.09494 |
| 100 +: | $ 2.90153 |
| 250 +: | $ 2.70809 |
| 500 +: | $ 2.51466 |
| 1000 +: | $ 2.46630 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.30°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is important in electronic systems to maintain acceptable system performance and lifetime; there is a need for components that are capable of dissipating heat generated by processors and other devices. Heat sinks are one such component. They help lower the temperature of the hot spot by transferring thermal energy from the processor’s core to the air that circulates around it. If the thermal energy is not removed, the processor will eventually overheat, leading to hardware damage and potential system failure. The ATS-54325D-C1-R0 is a highly efficient, cost-effective heat sink designed to provide effective thermal management in a wide range of applications.
The ATS-54325D-C1-R0 is a finned extruded aluminum heat sink with a compact design that allows it to fit in tight spots yet still provide efficient cooling performance. The heat sink’s extruded fins facilitate rapid and even thermal dissipation by providing increased surface area over which heat transfer can take place. Additionally, the heat sink is pre-painted with a high-grade corrosion-resistant finish for protection from environmental factors that could otherwise compromise the unit’s performance. Emission of electromagnetic radiation is minimized thanks to the aluminum construction, making the ATS-54325D-C1-R0 an ideal solution for industrial, commercial, medical, and other applications requiring low EMI.
The ATS-54325D-C1-R0 works by using the natural convection of air to draw heat away from the processor. Ambient air moves up through the fins of the heat sink as it is heated by the processor core; as the air rises, it carries with it thermal energy, which is dissipated at the heat sink’s surface. This convective air movement helps the heat sink draw heat away from the core to be dissipated into the environment. Additionally, the vast surface area of the fins allows for efficient and uniform dissipation of the thermal energy generated by the processor.
The ATS-54325D-C1-R0 is well suited to a wide range of applications, including desktop PCs, embedded devices, power conversion systems, and handheld devices. It is also suitable for industrial control systems, laboratory equipment, and medical devices, thanks to its low EMI profile. Because of its cost-effectiveness, the ATS-54325D-C1-R0 is an excellent choice for applications requiring superior thermal management but with tight budgets. It is also very easy to install, as the unit comes fully assembled and requires no complex mounting. The ATS-54325D-C1-R0 is an ideal solution for anyone looking for an effective and economical heat sink.
The specific data is subject to PDF, and the above content is for reference