| Allicdata Part #: | ATS-54325K-C0-R0-ND |
| Manufacturer Part#: |
ATS-54325K-C0-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 32.5X32.5X14.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54325K-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal management solutions are essential for protecting electronic components and ensuring proper system functioning. ATS-54325K-C0-R0 is a thermal-heat sink that can effectively help to dissipate heat from devices and help to maintain optimal operating temperature.
A thermal-heat sink is a metal device that is designed to absorb and dissipate heat from electronics components and disperse the heat away from the components. ATS-54325K-C0-R0 uses optimized metal alloy and fin design to promote efficient heat dissipation and cooling. Its construction includes several components which work together to maximize the heat transferring abilities.
The sink is made up of a main body, fins, heat-conducting base and an attached fan which are designed to work together to optimize thermal performance. The main body is made with highly tensioned aluminum or copper material specifically chosen for its thermal conductvity to ensure maximum heat is absorbed and transferred away from the device. The fins on the thermal-heat sink are strategically designed to increase its surface area so more heat can be dissipated. This design works to increase air flow over the heatsink allowing the heat to quickly move away from the device.
The heat-conducting base is a flat surface attached to the bottom of the main body used to transfer heat away from the device. This is often made from aluminum, copper, or a combination of both to take advantage of their thermal capabilities. The base is then connected to the fan through the fins. The fan acts to exhaust the heat away from the device and keep the device cool while in operation.
The ability of ATS-54325K-C0-R0 to dissipate heat efficiently makes it well suited for a wide range of applications. Its design makes it suitable for applications where high performance cooling is necessary. This includes computer components such as graphics cards, CPU’s, and other high performance chips that require cooling. The sink can also be used in various industrial equipment including engines, generators, and other machinery that produces large amounts of heat.
ATS-54325K-C0-R0 thermal-heat sink is the perfect solution for applications that require effective thermal management. Its efficient design requires minimal setup and can provide reliable cooling for a long time. Its lightweight design also makes it an ideal solution for applications that require regular maintenance. This sink is an excellent choice for anyone looking for an efficient and cost-effective thermal management solution.
The specific data is subject to PDF, and the above content is for reference