| Allicdata Part #: | ATS1222-ND |
| Manufacturer Part#: |
ATS-54325K-C1-R0 |
| Price: | $ 4.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 32.5 X 32.5 X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54325K-C1-R0 Datasheet/PDF |
| Quantity: | 47 |
| 1 +: | $ 4.23990 |
| 10 +: | $ 4.12335 |
| 25 +: | $ 3.89416 |
| 50 +: | $ 3.66509 |
| 100 +: | $ 3.43602 |
| 250 +: | $ 3.20695 |
| 500 +: | $ 2.97788 |
| 1000 +: | $ 2.92062 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.280" (32.51mm) |
| Width: | 1.280" (32.51mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.90°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is important to many designs and processes, and Heat Sinks are an important component used to dissipate heat. The ATS-54325K-C1-R0 is a high performance thermal management device specialized for use in applications with high density thermal loads.
The ATS-54325K-C1-R0 is a combination of Heat Sink and Heat Pipe and has the advantages of both. The Heat Sink passively circulates air past the surface of the sink, and the Heat Pipe wicks heat away from the heated components and radiates the heat off the fins of the Heat Sink. This combination provides excellent thermal performance in even the most demanding applications.
The ATS-54325K-C1-R0 is designed for applications where the need to dissipate large amounts of heat is required. It is well suited for servers, rackmount systems, telecommunications equipment, industrial controllers, and data storage systems. It is also suitable for applications with lower thermal loads, such as mobile devices and portable electronics. The design of the ATS-54325K-C1-R0 makes it much lighter than a traditional Heat Sink, and it takes up very little space, allowing it to fit in tight spaces where a traditional Heat Sink would be too bulky.
To ensure the best performance of the ATS-54325K-C1-R0, it should be used in conjunction with a fan. The fan provides airflow through the Heat Sink, which helps to cool the Heat Pipe, and it also helps to direct hot air away from the components.
The ATS-54325K-C1-R0 operates using a combination of convection and conduction. The Heat Pipe is filled with a liquid coolant, which is heated by the device being cooled. The liquid coolant then rises up through the Heat Pipe, where it is cooled by the airflow generated by the fan. The cooled liquid then descends back down the Heat Pipe, where it is heated again and the cycle begins anew. The flow of air is also used to dissipate the heat from the fins of the Heat Sink, allowing for improved performance.
The ATS-54325K-C1-R0 is a great choice for applications requiring high thermal performance in a small form factor. Its combination of Heat Sink and Heat Pipe provides excellent thermal efficiency and ensures the highest levels of performance. With its low weight and low profile design, it is the perfect choice for applications where heat must be kept to a minimum.
The specific data is subject to PDF, and the above content is for reference