| Allicdata Part #: | ATS1257-ND |
| Manufacturer Part#: |
ATS-54330W-C1-R0 |
| Price: | $ 5.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 33MM X 33MM X 24.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54330W-C1-R0 Datasheet/PDF |
| Quantity: | 29 |
| 1 +: | $ 5.39280 |
| 10 +: | $ 5.24538 |
| 25 +: | $ 4.95432 |
| 50 +: | $ 4.66276 |
| 100 +: | $ 4.37138 |
| 250 +: | $ 4.07996 |
| 500 +: | $ 3.78853 |
| 1000 +: | $ 3.71568 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.299" (32.99mm) |
| Width: | 1.299" (32.99mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.965" (24.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-54330W-C1-R0 thermal-heat sink is an ideal heat dissipation device for industrial and consumer applications, providing economical and efficient cooling. It can be used to cool CPU chips, high-power amplifiers, and other high-powered electronic components. The heat sink is constructed from an aluminum extrusion with a high quality anodized finish to resist corrosion and offer long lasting performance. It is designed to provide optimal thermal performance while minimizing the size, weight, and cost of the unit.
The heat sink is designed with a fin-design that increases the surface area allowing more efficient heat transmission from the components. The fins act as natural "fins" that conduct heat away from the components, allowing the heat to dissipate into the surrounding environment. The material used to construct the fins is also important, as it will affect the overall efficiency, weight, and cost of the unit. Different materials can also offer different noise levels, as some materials may absorb more or less sound than others.
In addition to being effective at dissipating heat, the ATS-54330W-C1-R0 is also designed to be lightweight and easy to install. Its low profile design makes it suitable for applications where space is at a premium. It also comes with a mounting system that allows it to be easily installed on any surface with minimal effort. This reduces installation times and eliminates the need for specialized tools or fixtures.
The ATS-54330W-C1-R0 works by drawing heat away from the component being cooled. It does this through the use of a thermal pad that adheres to the heat source and transfers the heat to the fins. The fins then dissipate the heat to the surrounding environment. This is effective in cooling CPU chips, high-power amplifiers, and other high-power electronic components. The heat dissipated by the thermal-heat sink is determined by the amount of heat being generated, the size and design of the unit, and the efficiency of the fins.
The ATS-54330W-C1-R0 is a cost-effective and efficient cooling solution for many industrial and consumer applications. It is designed to provide effective thermal performance while being lightweight and easy to install. The fins on the unit also help to dissipate heat effectively, while the mounting system allows it to be quickly and easily installed on any surface. With its superior cooling capabilities and ease of installation, the ATS-54330W-C1-R0 is an ideal thermal-heat sink for a variety of applications.
The specific data is subject to PDF, and the above content is for reference