ATS-54350R-C1-R0

Series:	--
Part Status:	Active
Type:	Top Mount
Package Cooled:	BGA
Attachment Method:	Thermal Tape, Adhesive (Included)
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.768" (19.50mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	3.80°C/W @ 200 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Black Anodized

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ATS-54350R-C1-R0 Thermal - Heat Sinks: Application Field and Working Principle

Thermal - Heat Sinks are a component widely utilized in electronic systems to regulate the temperature of various components to ensure they are kept within the specified performance range. ATS-54350R-C1-R0 is a type of thermal - heat sink often used in the industrial and automotive industry. In this article, we shall discuss the application field of the ATS-54350R-C1-R0 thermal - heat sink and the working principle behind its design.

Application Field of the ATS-54350R-C1-R0 Thermal - Heat Sink

The ATS-54350R-C1-R0 Thermal - Heat Sink is a widely utilized component used for thermal management systems in various electronic hardware systems. It is designed to provide superior thermal control and manage the heat output from electronics components for optimal performance. The ATS-54350R-C1-R0 Thermal - Heat Sink can be used in a variety of applications such as computer hardware, automotive electronics, office machinery, and other industrial applications. It is suitable for a wide array of different chips, devices, and components with maximum temperatures of up to 150°C. The ATS-54350R-C1-R0 Thermal - Heat Sink has been designed to be versatile and can fit most applications with ease, making it a great choice for many different systems.

Working Principle of the ATS-54350R-C1-R0 Thermal - Heat Sink

The ATS-54350R-C1-R0 Thermal-Heat Sink is designed to transfer heat away from components for optimal performance and to regulate the temperatures of different components in the system. This heat sink is designed to quickly dissipate heat through aluminum fins with an area of between 450 and 490 cm2. The fins help to create a larger surface area to increase heat dissipation. The ATS-54350R-C1-R0 Thermal-Heat Sink is also designed to utilize a special thermal-conducting silicone surface to further increase the efficiency of heat dissipation from the component. The silicone layer helps to improve the thermal contact between the heat source and the heat sink, allowing for faster and more efficient heat dissipation. In addition to the fins and the silicone layer, the ATS-54350R-C1-R0 Thermal-Heat Sink also uses a fan for active cooling. The fan helps to create a cooling effect by pushing air through the aluminum fins, helping to further improve thermal transfer. This fan is adjustable and can be set to different speeds to better suit the system requirements.

Conclusion

In conclusion, the ATS-54350R-C1-R0 Thermal - Heat Sink is a great choice for many different applications such as computer hardware, automotive electronics, office machinery, and other industrial applications. Not only is it versatile and can fit different systems with ease, its advanced design also helps to improve thermal transfer and dissipate heat from components with ease. Its aluminum fins, thermal-conducting silicone surface, and adjustable fan help to ensure optimal performance of the system.

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