| Allicdata Part #: | ATS-54375D-C0-R0-ND |
| Manufacturer Part#: |
ATS-54375D-C0-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 37.5X37.5X9.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54375D-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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The ATS-54375D-C0-R0 is a high-performance thermal device, commonly used in industrial cooling, aerodynamics, and other applications requiring the efficient transfer and dissipating of heat. Its benefits, which include low thermal resistance, excellent thermal performance, and high reliability, have made this device one of the industry standards for thermal management solutions.
The ATS-54375D-C0-R0 is a heat sink with a direct thermal cooling system, allowing for effective heat transfer from the heat source to the cooling environment. It features a built-in fan to aid in dissipating heat away from the integrated circuit. The fan also helps keep the device cool, even at high levels of power dissipation which could otherwise lead to overheating.
The ATS-54375D-C0-R0 has a low thermal resistance, allowing for efficient heat transfer and high reliability. Its mounting system is designed for convenience and flexibility, allowing for quick and easy mounting to devices such as microprocessors, memory, and other heat-generating components.
The ATS-54375D-C0-R0 also boasts excellent thermal performance, with a broad temperature range and high thermal efficiency. The heat sink is designed to maintain a low junction temperature even at high levels of power dissipation. This ensures a wide variety of application areas from commercial applications such as communication and computing to specialty applications such as automotive and consumer electronics.
The ATS-54375D-C0-R0 is a versatile and reliable solution for efficient thermal management. With its broad temperature range, low thermal resistance, and excellent thermal performance, it is an ideal solution for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference