| Allicdata Part #: | ATS1225-ND |
| Manufacturer Part#: |
ATS-54375K-C1-R0 |
| Price: | $ 4.80 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 37.5 X 37.5 X 14.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54375K-C1-R0 Datasheet/PDF |
| Quantity: | 24 |
| 1 +: | $ 4.32180 |
| 10 +: | $ 4.20336 |
| 25 +: | $ 3.96976 |
| 50 +: | $ 3.73640 |
| 100 +: | $ 3.50286 |
| 250 +: | $ 3.26932 |
| 500 +: | $ 3.03580 |
| 1000 +: | $ 2.97741 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.571" (14.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks have become a popular choice for applications requiring effective heat dissipation. Not only do they offer a solution that is extremely reliable and durable, but they also have a wide range of applications. One of the most common heat sink designs on the market is the ATS-54375K-C1-R0. This product offers exceptional performance when used in applications that require the highest levels of cooling efficiency.
The ATS-54375K-C1-R0 is a plate-fin type of heat sink. It is made from a metal material that has been designed specifically to act as a heat spreader in electronics applications. The heat sink consists of a base plate and finned elements, which are designed to direct air flow to where the most heat dissipates. This design results in a highly efficient cooling system that is also light weight and cost effective.
The primary application for the ATS-54375K-C1-R0 is thermal cooling. It is designed specifically to handle the high temperatures associated with electronic components. With the optimal flow of air produced by the design of its fins, the heat sink is able to reduce the temperature of the components it is attached to, while remaining cool enough to prevent system overheating. This heat dissipation prevents components from becoming damaged or failing prematurely due to heat.
Another key application for the ATS-54375K-C1-R0 is energy conservation. A great amount of energy is produced from electronics components when they are in operation. The heat of this energy production is often wasted, resulting in efficiency losses. With the ATS-54375K-C1-R0, the heat produced can be efficiently removed, allowing the component to use the energy to its full potential.
The working principle of the ATS-54375K-C1-R0 follows the same principles as any other thermal heat sink. It utilizes an array of fins to spread the heat from the component across a large surface area. This allows for more efficient and effective heat transfer from the component to the air. The fins act as radiators, while the base plate dissipates the heat to the surrounding environment. The combination of these two components results in a very efficient cooling system.
In conclusion, the ATS-54375K-C1-R0 is an excellent heat sink for a wide range of applications. It offers superior cooling performance and energy conservation capabilities, making it an ideal choice for those who require reliable and efficient thermal cooling solutions. By utilizing the principles of air and heat transfer, the ATS-54375K-C1-R0 is able to provide maximum levels of cooling and energy conservation for a variety of electronics components.
The specific data is subject to PDF, and the above content is for reference