| Allicdata Part #: | ATS-54375R-C0-R0-ND |
| Manufacturer Part#: |
ATS-54375R-C0-R0 |
| Price: | $ 4.73 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 37.5X37.5X19.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54375R-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.25628 |
| 30 +: | $ 4.02003 |
| 50 +: | $ 3.78365 |
| 100 +: | $ 3.54715 |
| 250 +: | $ 3.31068 |
| 500 +: | $ 3.07420 |
| 1000 +: | $ 3.01508 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 1.476" (37.50mm) |
| Width: | 1.476" (37.50mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal heat sinks are essential components in any electronic system that requires heat removal due to thermal generated power levels. The ATS-54375R-C0-R0 application field and working principles are important topics to understand the capabilities of such a device. Heat sinks are designed to conduct heat away from a given thermal environment, typically central processing units (CPUs), central memory modules (CMM), or any other type of electronic component that generates a substantial amount of thermal energy.
The ATS-54375R-C0-R0 heat sink is suitable for applications such as computers, home theater systems, cell phones, game consoles, and any other type of electronic device where heat removal is critical for proper operation and stability. The ATS-54375R-C0-R0 has an extruded aluminum construction with a black anodized finish, making it extremely efficient at dissipating heat and providing excellent thermal conductivity. It consists of an open-area base, heat spreader, and air-intake fins that are formed to provide enhanced cooling performance. With the included self-adhesive backplate, the ATS-54375R-C0-R0 is easy to install and will quickly become the optimal heat-dissipation device for a variety of applications.
The working principle of the ATS-54375R-C0-R0 heat sink is simple based on the basic principles of thermal dynamics. The aluminum construction of the heat sink consists of a fan base, a spreader plate, and air-intake fins. This arrangement helps to draw in hot air and radiant heat, transferring it away from the heat-producing components. The transfer of heat in this manner is maximized by the design of the spreader plate, which acts as an area of conductive transfer. This arrangement helps to minimize the resistance of the heat to the thermal dissipating material, increasing overall efficiency.
The ATS-54375R-C0-R0 heat sink is capable of dissipating a maximum of 70 watts and has an effective area of 87 cm². The airflow rate generated by the fan is adjustable to allow for greater heat dissipation, and the noise level emitted by the device is minimal. The thermal performance of the ATS-54375R-C0-R0 is enhanced by the use of a special design that combines copper inserts into the aluminum structure, allowing for greater heat transfer rates and improved cooling performance.
The ATS-54375R-C0-R0 heat sink has an overall weight of 2.1 Kg and is suitable for a variety of thermal applications. It offers an exceptional level of thermal efficiency and stability, making it an ideal cooling solution for high-performance computers, gaming consoles, and other electronic devices. The ATS-54375R-C0-R0 is an excellent example of how thermal heat sinks can provide superior heat-dissipation capabilities for a wide range of electronic components.
The specific data is subject to PDF, and the above content is for reference