| Allicdata Part #: | ATS1209-ND |
| Manufacturer Part#: |
ATS-54400D-C1-R0 |
| Price: | $ 4.06 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 40MM X 40MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54400D-C1-R0 Datasheet/PDF |
| Quantity: | 99 |
| 1 +: | $ 3.68550 |
| 10 +: | $ 3.58470 |
| 25 +: | $ 3.38587 |
| 50 +: | $ 3.18654 |
| 100 +: | $ 2.98746 |
| 250 +: | $ 2.78828 |
| 500 +: | $ 2.58911 |
| 1000 +: | $ 2.53931 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.10°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is a critical component of many engineering applications. Heat sinks are an important part of the thermal management system and play an important role in preventing overheating of delicate components. ATS-54400D-C1-R0 is a type of heat sink that is used in many engineering applications, such as data centers, PC components, semiconductors, telecommunications equipment, aerospace components, and consumer electronics. This article will explore in further detail the application field and working principle of the ATS-54400D-C1-R0 heat sink.
Design of the ATS-54400D-C1-R0 heat sink is based on a pin-fin shape. The pin-fin shape of the heat sink results in an increased heat transfer area with a low-profile design. The pins are made of thermally conductive aluminum alloy and are soldered onto the heat sink base to create a large heat transfer area. In addition, there is a layer of thermal interface material (TIM) between the pins and the heat sink base to further enhance the thermal transfer. The heat sink is also designed to be lightweight and has a low-noise operation. A combination of these features results in a highly efficient heat sink.
The ATS-54400D-C1-R0 heat sink is typically used in applications where components require a steady and consistent thermal performance, such as medical, telecommunications, and industrial applications. As the heat sink has a low-noise operation and is lightweight, it is ideal for applications where noise levels are critical or where space is limited. The heat sink is also suitable for low-heat dissipating components, as it has a high thermal conductivity to maximize heat transfer.
The working principle of the ATS-54400D-C1-R0 heat sink is based on the pin-fin shape. The pins of the heat sink are designed to transfer the heat from the component to the heat sink base. As the pins are soldered onto the heat sink base, the heat is dissipated through the heat sink base, which is then transferred into the surrounding air. The heat sink is designed in such a way that the hot air is expelled through the sides of the heat sink, thus avoiding internal buildup of heat and ensuring all heat is dissipated in an efficient manner.
In conclusion, the ATS-54400D-C1-R0 heat sink is a type of pin-fin heat sink that is used in many engineering applications. It is lightweight and has a low-noise operation, which makes it ideal for applications where noise levels or space are a concern. The working principle of the heat sink is based on the pin-fin shape, which allows efficient heat transfer from the component to the heat sink base and then into the surrounding air. This type of thermal management solution is designed to provide consistent thermal performance and is suitable for low-heat dissipating components.
The specific data is subject to PDF, and the above content is for reference