Allicdata Part #: | ATS1260-ND |
Manufacturer Part#: |
ATS-54400W-C1-R0 |
Price: | $ 6.08 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEAT SINK 40MM X 40MM X 24.5MM |
More Detail: | Heat Sink BGA Aluminum Top Mount |
DataSheet: | ATS-54400W-C1-R0 Datasheet/PDF |
Quantity: | 105 |
1 +: | $ 5.53140 |
10 +: | $ 5.38335 |
25 +: | $ 5.08410 |
50 +: | $ 4.78498 |
100 +: | $ 4.48592 |
250 +: | $ 4.18685 |
500 +: | $ 3.88779 |
1000 +: | $ 3.81303 |
Series: | -- |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | BGA |
Attachment Method: | Thermal Tape, Adhesive (Included) |
Shape: | Square, Fins |
Length: | 1.575" (40.00mm) |
Width: | 1.575" (40.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.965" (24.50mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 2.40°C/W @ 200 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Black Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATI-54400W-C1-R0 is a thermal heat sink designed for applications ranging from industrial electronics to consumer electronics. The device is capable of dissipating heat generated from a wide range of components, like processors, capacitors, and other devices. Despite its compact footprint, it boasts a high temperature rating and long-term reliability.
This heat sink is constructed from anodized aluminum, which provides excellent heat transfer properties and a high thermal-conductivity-to-weight ratio. By utilizing multiple independent surfaces, it increases heat dissipation and aids in thermal management. It is able to work within a broad range of temperatures while still providing a high level of thermal efficiency.
The ATI-54400W-C1-R0 utilizes a two-stage design that ensures reliable thermal management and offers higher temperature ratings and stability. It has a unique asymmetrical fin design that creates a broader air turbulence zone around the heat sink. This leads to improved heat dissipation due to the increase in surface area. Additionally, it utilizes advanced cavity designs that increase convection performance. This allows for better cooling and higher performance.
The device is also designed to reduce the vibration generated during thermal cycling. This is achieved by using special dampening membranes and minimization of airflow turbulence. To further maximize heat dissipation, it features grooved patterns on its surface. These grooves increase the number of contact points and help to spread the heat out more evenly.
The ATI-54400W-C1-R0 is also designed with an electronically-commutated fan that allows it to automatically adjust its speed to match the specific temperature requirements. This ensures quiet operation while still delivering superior thermal performance. Additionally, the fan is designed to draw in cool air from the outside of the chassis to reduce the accumulation of heat from other components in the device.
The ATI-54400W-C1-R0 heat sink is an effective solution for numerous industrial and consumer electronic applications. It provides high levels of thermal dissipation and stability while still maintaining a compact size. Additionally, its two-stage design allows for improved heat dissipation and its advanced fan helps to reduce noise and improve cooling. All these features make it an ideal choice for applications that require high performance cooling solutions.
The specific data is subject to PDF, and the above content is for reference