| Allicdata Part #: | ATS-54425R-C0-R0-ND |
| Manufacturer Part#: |
ATS-54425R-C0-R0 |
| Price: | $ 4.82 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 42.5X42.5X19.5MM NO TIM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-54425R-C0-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.33755 |
| 30 +: | $ 4.09668 |
| 50 +: | $ 3.85560 |
| 100 +: | $ 3.61463 |
| 250 +: | $ 3.37365 |
| 500 +: | $ 3.13267 |
| 1000 +: | $ 3.07243 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square, Fins |
| Length: | 1.673" (42.50mm) |
| Width: | 1.673" (42.49mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.768" (19.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.00°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal-heat sinks are vital components of any electronic device, as they provide a pathway for heat to dissipate away from the system. While many thermal solutions exist, a popular option is the ATS-54425R-C0-R0 heat sink. Understanding the design of this heat sink and its capabilities can help customers make an informed purchasing decision for their thermal solution.
Structurally, the ATS-54425R-C0-R0 is a thermal-heat sink that combines a metal fin design with a heat pipe in the center. The fin design consists of overlapping metal plates that form a heat conduction pathway to dissipate heat away from the system. The heat pipe is an innovative feature that draws thermal energy away from the system more efficiently, and distributes it around the fin design, allowing for more effective dissipation of heat. This combination of features makes the ATS-54425R-C0-R0 an effective and efficient heat sink that dissipates heat quickly and efficiently.
The ATS-54425R-C0-R0 was designed to be used in a wide variety of applications, ranging from CPU thermal management to machine control systems and small form factor computers. This wide range of uses is made possible by its small size and effective thermal performance. It features a footprint of only 25 mm by 25 mm, allowing it to be installed in cramped spaces that would not be possible with other, larger heat sinks. Additionally, its embedded heat pipe and fin design provided enhanced thermal performance, allowing the ATS-54425R-C0-R0 to be used in applications that require higher levels of thermal management.
In addition to its small size, the ATS-54425R-C0-R0 also offers optimal thermal management due to its innovative design. The incorporation of a heat pipe allows for more efficient thermal dissipation, as it acts as a conduit for thermal energy to travel quickly and efficiently away from the thermal source. This allows the heat sink to handle high levels of thermal load without becoming overwhelmed, and helps prevent system instability due to overheating. Additionally, its fin design allows for increased amounts of surface area to allow for maximum heat dissipation.
Overall, the ATS-54425R-C0-R0 heat sink is an ideal solution for customers looking for a reliable and efficient thermal management solution for their electronic devices. With its small size, efficient thermal properties, and efficient heat pipe technology, it can provide optimal thermal performance for any application. Its compact design also allows it to be installed in constrained spaces, while still providing effective thermal management. As such, the ATS-54425R-C0-R0 provides customers with an ideal solution for their thermal management needs.
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