| Allicdata Part #: | ATS1263-ND |
| Manufacturer Part#: |
ATS-55150D-C1-R0 |
| Price: | $ 3.74 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEAT SINK 15MM X 15MM X 9.5MM |
| More Detail: | Heat Sink BGA Aluminum Top Mount |
| DataSheet: |  ATS-55150D-C1-R0 Datasheet/PDF |
| Quantity: | 1531 |
| 1 +: | $ 3.39570 |
| 10 +: | $ 3.30498 |
| 25 +: | $ 3.21552 |
| 50 +: | $ 3.03698 |
| 100 +: | $ 2.85831 |
| 250 +: | $ 2.67964 |
| 500 +: | $ 2.59032 |
| 1000 +: | $ 2.32236 |
| Series: | -- |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | BGA |
| Attachment Method: | Thermal Tape, Adhesive (Included) |
| Shape: | Square, Fins |
| Length: | 0.590" (15.00mm) |
| Width: | 0.590" (15.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 29.50°C/W @ 200 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Black Anodized |
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Thermal - Heat Sinks
Heat sinks are a type of passive thermal device that is used to help disperse heat from electronic components, such as microprocessors and other semiconductor devices. Heat sinks are typically made from metal, such as aluminum or copper, and are designed with a high thermal conductivity to better transfer heat away from the component. Heat sinks also provide a surface area for air to move over, which helps to further dissipate the heat.
ATS-55150D-C1-R0 application field and working principle
The ATS-55150D-C1-R0 series of heat sinks are ideal for applications that require a high thermal dissipation rate, with an integrated fan to force convective cooling. The ATS-55150D-C1-R0 is designed to handle temperatures up to 150°C (302°F) and can be placed in a variety of small to medium-sized packages. ATS-55150D-C1-R0 heat sinks have a low profile design and a maximum permissible temperature of 150°C (302°F) for the extruded aluminum plate. The fan is located on the center of the aluminium plate, providing a reliable cooling source.
The ATS-55150D-C1-R0 heat sinks are ideal for consumer electronics, instrumentation, aerospace, military, automotive, and industrial devices. They provide an effective thermal solution for applications that require a high thermal dissipation rate and are used in a variety of microprocessors and other semiconductor devices.
The ATS-55150D-C1-R0 heat sinks work by transferring heat away from the heat source, using the thermal conductivity of the material. The fan on the ATS-55150D-C1-R0 helps to create a convective cooling flow of air over the heat sink, which further increases the rate of heat transfer. The fan also helps to increase the air flow rate around the heat sink, to dissipate heat more quickly. The ATS-55150D-C1-R0 also features a built-in thermal sensor, which can be used to monitor the thermal performance of the heat sink.
The ATS-55150D-C1-R0 heat sinks provide a reliable and effective thermal solution for a variety of applications. They are easy to install and maintain, and are suitable for a wide range of temperatures. With the built-in thermal sensor and fan, the ATS-55150D-C1-R0 is a reliable and efficient thermal solution for a variety of applications that require a high level of thermal efficiency.
The specific data is subject to PDF, and the above content is for reference